Electromagnetic microactuators with on-chip resin-bonded permanent magnets

David Schreiber, Slava Krylov, Yosi Shacham-Diamand, Timur Sibgatullin

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work we present modeling, fabrication and characterization of novel electromagnetic microactuators with integrated resin-bonded hard magnets embedded in the handle of silicon-on-insulator (SOI) wafers. Trenches etched through the handle of the SOI wafers are filled with the resin-bonded magnet material and allowed to cure at ambient temperature. Clamped-clamped beams fabricated from the single crystal silicon device layer of the SOI wafer are fabricated above the resin-bonded magnet filled trenches. Applying alternating current through the beam produces steady out-of-plane displacements due to resistive Joule heating and excites in-plane resonant vibrations due to Lorentz force coupling. The 8 mm long, 32 μm wide beams produced a maximum in-plane amplitude of 4.2 μm under an applied 2.4 mA current while the resonant frequency was tuned by changing the current amplitude. The results provided by the coupled thermo-electro-mechanical model of the beam and backed by experiments suggest that the integrated resin bonded magnets can be efficiently used for the actuation of micro structures.

Original languageEnglish
Title of host publication2008 Proceedings of the 9th Biennial Conference on Engineering Systems Design and Analysis
Pages319-325
Number of pages7
StatePublished - 2009
Event2008 9th Biennial Conference on Engineering Systems Design and Analysis - Haifa, Israel
Duration: 7 Jul 20089 Jul 2008

Publication series

Name2008 Proceedings of the 9th Biennial Conference on Engineering Systems Design and Analysis
Volume4

Conference

Conference2008 9th Biennial Conference on Engineering Systems Design and Analysis
Country/TerritoryIsrael
CityHaifa
Period7/07/089/07/08

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