TY - JOUR
T1 - Electroless silver and its alloys for interconnect applications
AU - Zhu, L.
AU - Inberg, A.
AU - Croitoru, N.
AU - Shacham-Diamand, Y.
PY - 2000
Y1 - 2000
N2 - Thin film of silver (Ag) and its composition with tungsten (Ag-W) has been deposited by the electroless method on Pd activated (100) silicon, silicon dioxide, as well as on silver and cobalt seed-layers. The specific resistivity of Ag-W films were as low as 2 μΩ · cm and their reflectivity exceeds 90%. The added tungsten to the silver in the thin film improved significantly its corrosion stability and increased its hardness. The corresponding nano/atomic-level studies indicated on a structure similar to the silicon substrate. The role of tungsten in the silver matrix is in the form of WO3- salt, hence to produce the second phase particle (SPP) effect. The electroless deposited thick Ag-W layer has a spiral structure that is typical for the electrochemical mechanism of the film grouth.
AB - Thin film of silver (Ag) and its composition with tungsten (Ag-W) has been deposited by the electroless method on Pd activated (100) silicon, silicon dioxide, as well as on silver and cobalt seed-layers. The specific resistivity of Ag-W films were as low as 2 μΩ · cm and their reflectivity exceeds 90%. The added tungsten to the silver in the thin film improved significantly its corrosion stability and increased its hardness. The corresponding nano/atomic-level studies indicated on a structure similar to the silicon substrate. The role of tungsten in the silver matrix is in the form of WO3- salt, hence to produce the second phase particle (SPP) effect. The electroless deposited thick Ag-W layer has a spiral structure that is typical for the electrochemical mechanism of the film grouth.
UR - http://www.scopus.com/inward/record.url?scp=0034462319&partnerID=8YFLogxK
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AN - SCOPUS:0034462319
SN - 1048-0854
SP - 523
EP - 528
JO - Advanced Metallization Conference (AMC)
JF - Advanced Metallization Conference (AMC)
T2 - Advanced Metallization Conference 2000
Y2 - 2 October 2000 through 4 October 2000
ER -