Electroless silver and its alloys for interconnect applications

L. Zhu; A. Inberg; N. Croitoru; Y. Shacham-Diamand

Electroless silver and its alloys for interconnect applications

L. Zhu, A. Inberg, N. Croitoru, Y. Shacham-Diamand

Research output: Contribution to journal › Conference article › peer-review

Abstract

Thin film of silver (Ag) and its composition with tungsten (Ag-W) has been deposited by the electroless method on Pd activated (100) silicon, silicon dioxide, as well as on silver and cobalt seed-layers. The specific resistivity of Ag-W films were as low as 2 μΩ · cm and their reflectivity exceeds 90%. The added tungsten to the silver in the thin film improved significantly its corrosion stability and increased its hardness. The corresponding nano/atomic-level studies indicated on a structure similar to the silicon substrate. The role of tungsten in the silver matrix is in the form of WO_3- salt, hence to produce the second phase particle (SPP) effect. The electroless deposited thick Ag-W layer has a spiral structure that is typical for the electrochemical mechanism of the film grouth.

Original language	English
Pages (from-to)	523-528
Number of pages	6
Journal	Advanced Metallization Conference (AMC)
State	Published - 2000
Event	Advanced Metallization Conference 2000 - San Diego, CA, United States Duration: 2 Oct 2000 → 4 Oct 2000

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title = "Electroless silver and its alloys for interconnect applications",

abstract = "Thin film of silver (Ag) and its composition with tungsten (Ag-W) has been deposited by the electroless method on Pd activated (100) silicon, silicon dioxide, as well as on silver and cobalt seed-layers. The specific resistivity of Ag-W films were as low as 2 μΩ · cm and their reflectivity exceeds 90%. The added tungsten to the silver in the thin film improved significantly its corrosion stability and increased its hardness. The corresponding nano/atomic-level studies indicated on a structure similar to the silicon substrate. The role of tungsten in the silver matrix is in the form of WO3- salt, hence to produce the second phase particle (SPP) effect. The electroless deposited thick Ag-W layer has a spiral structure that is typical for the electrochemical mechanism of the film grouth.",

author = "L. Zhu and A. Inberg and N. Croitoru and Y. Shacham-Diamand",

year = "2000",

language = "אנגלית",

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journal = "Advanced Metallization Conference (AMC)",

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T1 - Electroless silver and its alloys for interconnect applications

AU - Zhu, L.

AU - Inberg, A.

AU - Croitoru, N.

AU - Shacham-Diamand, Y.

PY - 2000

Y1 - 2000

N2 - Thin film of silver (Ag) and its composition with tungsten (Ag-W) has been deposited by the electroless method on Pd activated (100) silicon, silicon dioxide, as well as on silver and cobalt seed-layers. The specific resistivity of Ag-W films were as low as 2 μΩ · cm and their reflectivity exceeds 90%. The added tungsten to the silver in the thin film improved significantly its corrosion stability and increased its hardness. The corresponding nano/atomic-level studies indicated on a structure similar to the silicon substrate. The role of tungsten in the silver matrix is in the form of WO3- salt, hence to produce the second phase particle (SPP) effect. The electroless deposited thick Ag-W layer has a spiral structure that is typical for the electrochemical mechanism of the film grouth.

AB - Thin film of silver (Ag) and its composition with tungsten (Ag-W) has been deposited by the electroless method on Pd activated (100) silicon, silicon dioxide, as well as on silver and cobalt seed-layers. The specific resistivity of Ag-W films were as low as 2 μΩ · cm and their reflectivity exceeds 90%. The added tungsten to the silver in the thin film improved significantly its corrosion stability and increased its hardness. The corresponding nano/atomic-level studies indicated on a structure similar to the silicon substrate. The role of tungsten in the silver matrix is in the form of WO3- salt, hence to produce the second phase particle (SPP) effect. The electroless deposited thick Ag-W layer has a spiral structure that is typical for the electrochemical mechanism of the film grouth.

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EP - 528

JO - Advanced Metallization Conference (AMC)

JF - Advanced Metallization Conference (AMC)

SN - 1540-1766

Y2 - 2 October 2000 through 4 October 2000

ER -

Electroless silver and its alloys for interconnect applications

Abstract

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