Electroless plating of silicon nitride using (3-aminopropyl) triethoxysilane

In this work we demonstrate electroless Cu and Ni-P (using both alkaline and acidic solutions) metallization of a silicon nitride surface. This was done by surface pretreatment with N H2 functionalization via silanization, followed by adsorption of PdSn nanoparticles onto the surface. Using this method, films of Ni-P and Cu were created and characterized. As a possible application we demonstrate metallization of atomic force microscope probes by Ni-P and Au (on top of the Ni-P from the acidic solution).