Electroless plating of silicon nitride using (3-aminopropyl) triethoxysilane

Amir Holtzman*, Shachar Richter

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


In this work we demonstrate electroless Cu and Ni-P (using both alkaline and acidic solutions) metallization of a silicon nitride surface. This was done by surface pretreatment with N H2 functionalization via silanization, followed by adsorption of PdSn nanoparticles onto the surface. Using this method, films of Ni-P and Cu were created and characterized. As a possible application we demonstrate metallization of atomic force microscope probes by Ni-P and Au (on top of the Ni-P from the acidic solution).

Original languageEnglish
Pages (from-to)D196-D202
JournalJournal of the Electrochemical Society
Issue number3
StatePublished - 2008


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