TY - GEN
T1 - Electroless Co(W,P) and Co(Mo,P) deposition for Cu metallization applications
AU - Shacham-Diamand, Y.
AU - Zylberman, A.
AU - Petrov, N.
AU - Sverdlov, Y.
N1 - Publisher Copyright:
© 2001 IEEE.
PY - 2001
Y1 - 2001
N2 - The barrier properties against Cu diffusion of thin-film (< 30 nm) Co(P) alloys are significantly improved when tungsten is added. It is not known whether the barrier properties are due to tungsten or any other refractory metal will have a similar effect. In this work we present a novel electroless cobalt-molybdenum-phosphorous Co(Mo,P) process. Both Co(W,P) and Co(Mo,P) deposition solutions were studied and we present their characteristics such as deposition rate and solid composition. We also present the thin film resistivity and show that the Mo alloy resistivity is higher than that of the W alloy. Auger electron Spectroscopy (AES) and X-ray Photon Spectroscopy (XPS) determined the film composition. The corrosion resistance of Co alloy/Cu/Co-alloy structures were studied by measuring the thin film resistance versus time at elevated temperatures, up to 350°C. We conclude that both W and Mo alloy have similar barrier and corrosion protection priorities. Therefore, the improved barrier properties, as compared to Co(P) alloy is due the refractory metal and not specific to W.
AB - The barrier properties against Cu diffusion of thin-film (< 30 nm) Co(P) alloys are significantly improved when tungsten is added. It is not known whether the barrier properties are due to tungsten or any other refractory metal will have a similar effect. In this work we present a novel electroless cobalt-molybdenum-phosphorous Co(Mo,P) process. Both Co(W,P) and Co(Mo,P) deposition solutions were studied and we present their characteristics such as deposition rate and solid composition. We also present the thin film resistivity and show that the Mo alloy resistivity is higher than that of the W alloy. Auger electron Spectroscopy (AES) and X-ray Photon Spectroscopy (XPS) determined the film composition. The corrosion resistance of Co alloy/Cu/Co-alloy structures were studied by measuring the thin film resistance versus time at elevated temperatures, up to 350°C. We conclude that both W and Mo alloy have similar barrier and corrosion protection priorities. Therefore, the improved barrier properties, as compared to Co(P) alloy is due the refractory metal and not specific to W.
UR - http://www.scopus.com/inward/record.url?scp=84966521948&partnerID=8YFLogxK
U2 - 10.1109/ICSICT.2001.981506
DO - 10.1109/ICSICT.2001.981506
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AN - SCOPUS:84966521948
T3 - 2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings
SP - 410
EP - 415
BT - 2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings
A2 - Iwai, Hiroshi
A2 - Yu, Paul
A2 - Li, Bing-Zong
A2 - Ru, Guo-Ping
A2 - Qu, Xin-Ping
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001
Y2 - 22 October 2001 through 25 October 2001
ER -