@inbook{007f901bcf7b47e3a027b07b6358124c,
title = "Electroless barrier and seed layers for on-chip metallization",
keywords = "Micro{\'e}lectronique, Mise sous bo{\^i}tier (micro{\'e}lectronique), Emballage, Microelectronic packaging",
author = "Dubin, {Valery M.} and Sergey Lopatin and Amit Kohn and Nick Petrov and Moshe Eizenberg and Yosi Shacham-Diamand",
year = "2004",
month = dec,
day = "20",
language = "אנגלית",
isbn = "041531190X",
series = "New trends in electrochemical technology",
publisher = "CRC Press",
pages = "65--110",
editor = "Datta, {M. } and Osaka, {Tetsuya } and Schultze, {J. Walter }",
booktitle = "Microelectronic packaging",
}