Electrochemically deposited thin film alloys for ULSI and MEMS applications

Keyphrases

• MEMS Application 100%
• Refractory Metals 100%
• Boron 100%
• Unique Properties 50%
• Silica 50%
• Low Stress 50%
• Nicu 50%
• Electroless 50%
• Electroless Deposition 50%
• High Selectivity 50%
• Thin Metal Films 50%
• Ni Alloy 50%
• Electrochemical Process 50%
• Ni-Co 50%
• Alloy Deposition 50%
• Tungsten 50%
• Molybdenum 50%
• Very Thin Films 50%
• Protection Layer 50%
• Composition Control 50%
• Interconnect Metallization 50%
• CoWP 50%
• Co-alloying 50%
• High Aspect Ratio Structure 50%
• Corrosion Protection 50%
• Electroforming 50%
• Layer Protection 50%
• Metallic Alloys 50%
• Barrier Protection 50%
• Iron Metal 50%
• Processing Stress 50%
• Deposition Mechanism 50%
• Silicon Technology 50%
• Conducting Layer 50%
• Low Temperature Process 50%

Material Science

• Silicon 100%
• Thin Films 100%
• Microelectromechanical System 100%
• Boron 100%
• Refractory Metal 100%
• Film 50%
• Tungsten 50%
• Electroless Deposition 50%
• Metal Film 50%
• Molybdenum 50%
• Corrosion Protection 50%