Electrochemical study and material characterization of electroless CoNiWPB thin films

Y. Shacham-Diamand*, Y. Sverdlov, A. Duchin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Electroless plating of thin NiCo alloy films has various applications such as magnetic thin-films and barrier and capping layers for copper metallization. The material properties depend on its composition which may depend on many variables. We propose a model based on the Langmuir-Hinshelwood mechanism, where the nickel and cobalt complexes compete on one type of sites while the deposition of the boron and phosphorous depends on reactions that occur on different sites. The tungsten deposition is proposed to occur also from complexes with cobalt and nickel. The proposed model depends on the adsorption sites characteristics and the chemical interaction of the metals with the complexing agents. In this paper we present a study of CoNiWPB alloys deposited from solutions containing nickel and cobalt sulfates, sodium tungstate as a source for tungsten, citric acid as a complexing agent and sodium-hypophosphite and di-methyl-amine-borane (DMAB) as reducing agents supplying both boron and phosphorous.

Original languageEnglish
Title of host publicationElectrodeposition of Nanoengineered Materials and Devices 3
PublisherElectrochemical Society Inc.
Number of pages10
ISBN (Electronic)9781566778152
ISBN (Print)9781566778152
StatePublished - 2009

Publication series

NameECS Transactions
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737


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