Flexible electrode chips were fabricated on polymer substrates, either SU-8 (epoxy-based photo-definable polymer) or PDMS (Polydimethylsiloxane, elastomer-base polymer), using a photolithography process. In one case, Ppy (Polypyrrole, a conductive polymer) was deposited on the electrodes' gold seed layer. In another case, Ppy was deposited on the micro actuator's copper seed layer, both cases by electropolymerization using cyclic voltammetry. Thus, we developed a process for a flexible electrode that integrates a polymer substrate and a conductive polymer. The polypyrrole is reinforcing the gold and copper wires and electrically shunting the interconnects, increasing thereby the device durability and reliability.