The electrical resistivity of thin electroless silver tungsten (Ag-W) films for metallization was discussed. The optimization of electroless deposition and the use of vacuum annealing yield decreased in the resistivity and its scatter in 100- and 50-nm Ag-W films. The physical processes which controlled the resistivity drop during low-temperature annealing were also discussed.
|Number of pages||6|
|State||Published - Nov 2003|
|Event||Materials for Advanced Metallization 2003 - La Londe Les Maures, France|
Duration: 9 Mar 2003 → 12 Mar 2003
- Electrical resistivity
- Thin electroless Ag-W films