Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines

Keyphrases

• Grain Growth 100%
• Passivated 100%
• Copper Line 100%
• Microstructure Growth 100%
• Stress Effect 33%
• Heat Treatment 33%
• Low Stress 33%
• High Stress 33%
• Thermal Treatment 33%
• Free Volume 33%
• Stress State 33%
• Preferred Sites 33%
• Passivation 33%
• Void Growth 33%
• Tantalum 33%
• Stress Induced Voiding 33%
• State Growth 33%

Engineering

• Microstructure 100%
• Heat Treatment 100%
• Passivation 50%
• Stress State 50%
• Void Growth 50%
• Induced Stress 50%
• Free Volume 50%