Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines

J. A. Nucci; Y. Shacham-Diamand; J. E. Sanchez

doi:10.1063/1.113795

Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines

J. A. Nucci^*, Y. Shacham-Diamand, J. E. Sanchez

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

24 Scopus citations

Abstract

Tantalum encapsulated copper lines, 0.5-2.0 μm wide, were passivated and heat treated to determine the effect of stress state, microstructure, and grain growth on stress-induced voiding. Void frequency and location were studied as a function of linewidth and heat treatment. Higher stress, narrow lines voided less than lower stress, wider lines. Voiding was also strongly dependent upon thermal treatment before and after passivation. These results are explained by defining preferred sites for void formation and by considering the release of free volume during grain growth in passivated lines.

Original language	English
Pages (from-to)	3576
Number of pages	1
Journal	Applied Physics Letters
Volume	66
DOIs	https://doi.org/10.1063/1.113795
State	Published - 1995
Externally published	Yes

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title = "Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines",

abstract = "Tantalum encapsulated copper lines, 0.5-2.0 μm wide, were passivated and heat treated to determine the effect of stress state, microstructure, and grain growth on stress-induced voiding. Void frequency and location were studied as a function of linewidth and heat treatment. Higher stress, narrow lines voided less than lower stress, wider lines. Voiding was also strongly dependent upon thermal treatment before and after passivation. These results are explained by defining preferred sites for void formation and by considering the release of free volume during grain growth in passivated lines.",

author = "Nucci, {J. A.} and Y. Shacham-Diamand and Sanchez, {J. E.}",

year = "1995",

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AU - Nucci, J. A.

AU - Shacham-Diamand, Y.

AU - Sanchez, J. E.

PY - 1995

Y1 - 1995

N2 - Tantalum encapsulated copper lines, 0.5-2.0 μm wide, were passivated and heat treated to determine the effect of stress state, microstructure, and grain growth on stress-induced voiding. Void frequency and location were studied as a function of linewidth and heat treatment. Higher stress, narrow lines voided less than lower stress, wider lines. Voiding was also strongly dependent upon thermal treatment before and after passivation. These results are explained by defining preferred sites for void formation and by considering the release of free volume during grain growth in passivated lines.

AB - Tantalum encapsulated copper lines, 0.5-2.0 μm wide, were passivated and heat treated to determine the effect of stress state, microstructure, and grain growth on stress-induced voiding. Void frequency and location were studied as a function of linewidth and heat treatment. Higher stress, narrow lines voided less than lower stress, wider lines. Voiding was also strongly dependent upon thermal treatment before and after passivation. These results are explained by defining preferred sites for void formation and by considering the release of free volume during grain growth in passivated lines.

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JO - Applied Physics Letters

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Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines

Abstract

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