Directed electroless deposition (ELD) of sub 50 nm interconnects on patterned selfassembled monolayers (SAM)

Nick Fishelson, Liron Marom, Alexandra Inberg, Yosi Shacham-Diamand

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

100 nm line features of gold on Si substrate are obtained by transferring a specified pattern by e-beams with characteristic parameters of 10 kV and 500 to 2000 μC/cm2 onto previously CH3-silanized SiO 2 surface, followed by directed NH2-silanization, activation with Au nanoparticles (NPs) from aqueous colloid and Au ELD from sulfite/ascorbate system. In electroless deposition, the novelty of this work is that the technique proposed is based on strong chemical affinity of ultrathin SAMs to catalyst and deposited metal. The organically modified surface is expected to promote both the metal phase lateral growth in ELD and enhanced adhesion of the deposit to molecularly smooth substrate. We introduce also to ELD technology the pre-synthesized mono-dispersions of small catalytic NPs (5 nm) whose mean size is at least by the order of magnitude lower than the characteristic size of the target metal features, which is a reasonable prerequisite for fine feature obtaining.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2007, AMC 2007
Pages397-401
Number of pages5
StatePublished - 2008
Event24th Session of the Advanced Metallization Conference 2007, AMC 2007 - Tokyo, Japan
Duration: 22 Oct 200724 Oct 2007

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766

Conference

Conference24th Session of the Advanced Metallization Conference 2007, AMC 2007
Country/TerritoryJapan
CityTokyo
Period22/10/0724/10/07

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