Direct monitoring of hot-carrier accumulated charge in GaN HEMT and PHEMT devices

A. Stopel, A. Khramtsov, O. Katz, S. Solodky, T. Baksht, Y. Knafo, M. Leibovitch, Yoram Shapira*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A contactless methodology of directly monitoring walkout phenomena in HEMT devices has been demonstrated for PHEMT and GaN HEMT devices. No walkout phenomena have been observed in GaN HEMT, while evolution of the surface photovoltage spectra (SPS) indicates accumulation of the positive electrical charge the buffer and surface layer of device, after RF power stress. In PHEMT, walkout phenomena are due to the accumulation of the charge at surface traps, which have been introduced during manufacturing process. The SPS make it easy to monitor this charge accumulation during RF power stress.

Original languageEnglish
Title of host publication2005 International Conference on Compound Semiconductor Manufacturing Technology
StatePublished - 2005
Event2005 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2005 - New Orleans, LA, United States
Duration: 11 Apr 200514 Apr 2005

Publication series

Name2005 International Conference on Compound Semiconductor Manufacturing Technology

Conference

Conference2005 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2005
Country/TerritoryUnited States
CityNew Orleans, LA
Period11/04/0514/04/05

Keywords

  • Device design
  • HEMT
  • Impact ionization
  • Surface photovoltage spectroscopy
  • Walkout

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