TY - JOUR
T1 - Diffusion bonding of transparent ceramics by spark plasma sintering (SPS) complemented by hot isostatic pressing (HIP)
AU - Cohen, Shahar
AU - Ratzker, Barak
AU - Kalabukhov, Sergey
AU - Frage, Nachum
N1 - Publisher Copyright:
© 2023
PY - 2023/11
Y1 - 2023/11
N2 - Diffusion bonding is a viable technique for fabricating larger parts or composite transparent ceramics. Spark plasma sintering (SPS) and hot isostatic pressing (HIP) allow for simultaneous application of high temperature and pressure, making them suitable for bonding various materials, including transparent ceramics. In this study, we demonstrated the combined use of SPS followed by HIP for successful diffusion bonding of transparent MgAl2O4 (spinel) and Y3Al5O12 (YAG) ceramics. The YAG samples had superior surface quality and were adequately bonded using SPS alone, while rougher spinel samples showed inadequate bonding initially due to insufficient surface contact. However, subsequent HIP treatment effectively closed the voids at the interface and promoted grain growth across the joint, resulting in a strong seamless bond. The combination of SPS and HIP, as a two-step process, holds promise for diffusion bonding of ceramics and offers a potential solution for compensating surface quality issues in the bonded parts.
AB - Diffusion bonding is a viable technique for fabricating larger parts or composite transparent ceramics. Spark plasma sintering (SPS) and hot isostatic pressing (HIP) allow for simultaneous application of high temperature and pressure, making them suitable for bonding various materials, including transparent ceramics. In this study, we demonstrated the combined use of SPS followed by HIP for successful diffusion bonding of transparent MgAl2O4 (spinel) and Y3Al5O12 (YAG) ceramics. The YAG samples had superior surface quality and were adequately bonded using SPS alone, while rougher spinel samples showed inadequate bonding initially due to insufficient surface contact. However, subsequent HIP treatment effectively closed the voids at the interface and promoted grain growth across the joint, resulting in a strong seamless bond. The combination of SPS and HIP, as a two-step process, holds promise for diffusion bonding of ceramics and offers a potential solution for compensating surface quality issues in the bonded parts.
KW - Joining
KW - Magnesium aluminate spinel (MgAlO)
KW - Oxides
KW - Yttrium aluminium garnet (YAlO)
UR - http://www.scopus.com/inward/record.url?scp=85164340447&partnerID=8YFLogxK
U2 - 10.1016/j.jeurceramsoc.2023.06.071
DO - 10.1016/j.jeurceramsoc.2023.06.071
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AN - SCOPUS:85164340447
SN - 0955-2219
VL - 43
SP - 6628
EP - 6633
JO - Journal of the European Ceramic Society
JF - Journal of the European Ceramic Society
IS - 14
ER -