TY - JOUR
T1 - DECISION ANALYSIS IN MICROELECTRONIC RELIABILITY
T2 - OPTIMAL DESIGN AND PACKAGING OF A DIODE ARRAY.
AU - Ronen, Boaz
AU - Pliskin, Joseph S.
PY - 1981
Y1 - 1981
N2 - Consideration is given to the quantitative aspects in microelectronic reliability using decision analysis. In a given electronic system, a diode array (i. e. , system of switches) serves as a built-in test circuit. Failure of a single component can disrupt system performance. Two failure modes are possible, short or open circuit, each resulting in different damages to the system. The decision analysis considers aspects of circuit design and packaging technology. Design involves a conventional system or one with redundancy. Important considerations are cost, total failure rate, proportion of each failure mode and malfunction costs. Three alternative packaging technologies are considered.
AB - Consideration is given to the quantitative aspects in microelectronic reliability using decision analysis. In a given electronic system, a diode array (i. e. , system of switches) serves as a built-in test circuit. Failure of a single component can disrupt system performance. Two failure modes are possible, short or open circuit, each resulting in different damages to the system. The decision analysis considers aspects of circuit design and packaging technology. Design involves a conventional system or one with redundancy. Important considerations are cost, total failure rate, proportion of each failure mode and malfunction costs. Three alternative packaging technologies are considered.
UR - http://www.scopus.com/inward/record.url?scp=0019541925&partnerID=8YFLogxK
U2 - 10.1287/opre.29.2.229
DO - 10.1287/opre.29.2.229
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AN - SCOPUS:0019541925
SN - 0030-364X
VL - 29
SP - 229
EP - 242
JO - Operations Research
JF - Operations Research
IS - 2
ER -