Consideration is given to the quantitative aspects in microelectronic reliability using decision analysis. In a given electronic system, a diode array (i. e. , system of switches) serves as a built-in test circuit. Failure of a single component can disrupt system performance. Two failure modes are possible, short or open circuit, each resulting in different damages to the system. The decision analysis considers aspects of circuit design and packaging technology. Design involves a conventional system or one with redundancy. Important considerations are cost, total failure rate, proportion of each failure mode and malfunction costs. Three alternative packaging technologies are considered.