Cu film deposition using a vacuum arc with a black-body electrode assembly

I. I. Beilis, Y. Koulik, R. L. Boxman

Research output: Contribution to journalArticlepeer-review

Abstract

A vacuum arc with black body electrode configuration is used to deposit thin Cu films on glass substrates. In this configuration, a cup shaped anode, a refractory insulator, and a water cooled cathode form an enclosed volume from which dense plasma of cathode material was extracted through different types of apertures (one hole, frontal or radial shower-head) in the anode. All materials emitted from the cathode (including macroparticles) were re-evaporated from the hot anode producing in the enclosed volume a dense plasma which extracted through the anode aperture. The Cu deposition rate with the frontal shower anode was about 3.6. μm/min at a distance Ls=. 80. mm from the anode for current 200. A. Deposition with the radial shower anode produced a film which was azimuthally equal. The cathode erosion rate with this electrode configuration was a factor of 2-3 lower than that in a conventional cathodic arc indicating higher cathode material utilization.

Original languageEnglish
Pages (from-to)908-912
Number of pages5
JournalSurface and Coatings Technology
Volume258
DOIs
StatePublished - 15 Nov 2014

Keywords

  • Cu cathode
  • Film deposition
  • Metallic plasma
  • Refractory anode
  • Vacuum arc

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