Compatibility of the Low-Dielectric-Constant Poly(arylether) with the Electroless Copper Deposition Solution

D. T. Hsu*, M. Iskandar, F. G. Shi, S. Lopatin, Y. Shacham-Diamand, H. Y. Tong, B. Zhao, M. Brongo, P. K. Vasudev

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Posssible interactions between nonfluorinated poly(arylether) thin films and the recently developed electroless Cu deposition solution are investigated. The results show that there is no chemical reaction between this low-dielectric-constant polymer and the electroless Cu deposition solution. However, a significant change in thickness as well as refractive index is induced by the electroless solution conditions. It is demonstrated that higher temperatures can alleviate the electroless Cu solution-induced effects as far as the glass transition temperature, the coefficient of thermal expansion, and refractive index are concerned.

Original languageEnglish
Pages (from-to)4565-4568
Number of pages4
JournalJournal of the Electrochemical Society
Volume146
Issue number12
DOIs
StatePublished - Dec 1999
Externally publishedYes

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