In this paper the fabrication and characterization of a novel implementation of micromachined accelerometers is reported. The accelerometers employ a new sensing technique, the modulated integrative differential optical sensing (MIDOS), to sense the output displacements of their proof-mass. The fabrication process of the hybrid device, which consists a bulk micromachined mechanical part attached by indium bumps to a CMOS chip containing photodetectors and readout electronics, is presented. Several prototypes were fabricated and characterized. The differences between the prototypes are discussed in details as well as the comparison between their measured characteristics (noise equivalent acceleration (NEA), bandwidth and linearity). The prototypes have demonstrated NEA ranging from 70[μg/√Hz] to 1[mg/√Hz] with bandwidth of 1 KHz to 4 KHz, respectively.
|Number of pages||6|
|State||Published - 1999|
|Event||Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA|
Duration: 17 Jan 1999 → 21 Jan 1999
|Conference||Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS|
|City||Orlando, FL, USA|
|Period||17/01/99 → 21/01/99|