TY - JOUR
T1 - Coherent J-Band radiating arrays based on ×27 CMOS activemultiplier chips
AU - Klimovich, Roman
AU - Jameson, Samuel
AU - Socher, Eran
N1 - Publisher Copyright:
Copyright © Cambridge University Press and the European Microwave Association 2019.
PY - 2019/10/1
Y1 - 2019/10/1
N2 - This paper presents a hybrid design of 1 × 2 and 1 × 4 arrays operating in 0.277-0.292 THz on 65 nm Complementary metal-oxide-semiconductor (CMOS) technology. Each of the chips has an X-band input with 3 ×3 multiplier stages and connected at the output to an on-chip ring antenna. A wideband microstrip Wilkinson four-way and two-way power dividers have been developed on a multilayer printed circuit board to feed the array elements with proper radio frequency and direct current inputs. Demonstrating improvements in effective isotropically radiated power and in total radiated power compared to a single CMOS element, the hybrid integration approach proves effective in implementing coherent THz transmitter arrays. Theoretical and practical factors that reduce the radiated power compared with ideal arrays are also discussed.
AB - This paper presents a hybrid design of 1 × 2 and 1 × 4 arrays operating in 0.277-0.292 THz on 65 nm Complementary metal-oxide-semiconductor (CMOS) technology. Each of the chips has an X-band input with 3 ×3 multiplier stages and connected at the output to an on-chip ring antenna. A wideband microstrip Wilkinson four-way and two-way power dividers have been developed on a multilayer printed circuit board to feed the array elements with proper radio frequency and direct current inputs. Demonstrating improvements in effective isotropically radiated power and in total radiated power compared to a single CMOS element, the hybrid integration approach proves effective in implementing coherent THz transmitter arrays. Theoretical and practical factors that reduce the radiated power compared with ideal arrays are also discussed.
KW - Active Array Antennas and Components
KW - Circuit Design and Applications
KW - Hybrid and Multi-Chip Modules
UR - http://www.scopus.com/inward/record.url?scp=85065238820&partnerID=8YFLogxK
U2 - 10.1017/S1759078719000436
DO - 10.1017/S1759078719000436
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AN - SCOPUS:85065238820
SN - 1759-0787
VL - 11
SP - 747
EP - 754
JO - International Journal of Microwave and Wireless Technologies
JF - International Journal of Microwave and Wireless Technologies
IS - 8
ER -