Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment

D. T. Hsu; F. G. Shi; S. Lopatin; Y. Shacham-Diamand; B. Zhao; M. Brongo; P. K. Vasudev

doi:10.1023/A:1006669728715

Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment

D. T. Hsu^*, F. G. Shi, S. Lopatin, Y. Shacham-Diamand, B. Zhao, M. Brongo, P. K. Vasudev

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

This study is directed towards the investigation of the compatibility between promising low-k materials and the electroless Cu deposition developed for sub-quarter-micron interconnect applications. The low-k materials used include two fluorinated polyimides, FPI-45M and FPI-136M. Fourier infrared (FTIR) spectroscopy is used to examine the possible chemical reactions between the low-k materials and electroless Cu deposition solution under different treatment solution temperatures and times.

Original language	English
Pages (from-to)	1465-1467
Number of pages	3
Journal	Journal of Materials Science Letters
Volume	18
Issue number	18
DOIs	https://doi.org/10.1023/A:1006669728715
State	Published - 1 Jan 1999
Externally published	Yes

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title = "Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment",

abstract = "This study is directed towards the investigation of the compatibility between promising low-k materials and the electroless Cu deposition developed for sub-quarter-micron interconnect applications. The low-k materials used include two fluorinated polyimides, FPI-45M and FPI-136M. Fourier infrared (FTIR) spectroscopy is used to examine the possible chemical reactions between the low-k materials and electroless Cu deposition solution under different treatment solution temperatures and times.",

author = "Hsu, {D. T.} and Shi, {F. G.} and S. Lopatin and Y. Shacham-Diamand and B. Zhao and M. Brongo and Vasudev, {P. K.}",

year = "1999",

month = jan,

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doi = "10.1023/A:1006669728715",

language = "אנגלית",

volume = "18",

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TY - JOUR

T1 - Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment

AU - Hsu, D. T.

AU - Shi, F. G.

AU - Lopatin, S.

AU - Shacham-Diamand, Y.

AU - Zhao, B.

AU - Brongo, M.

AU - Vasudev, P. K.

PY - 1999/1/1

Y1 - 1999/1/1

N2 - This study is directed towards the investigation of the compatibility between promising low-k materials and the electroless Cu deposition developed for sub-quarter-micron interconnect applications. The low-k materials used include two fluorinated polyimides, FPI-45M and FPI-136M. Fourier infrared (FTIR) spectroscopy is used to examine the possible chemical reactions between the low-k materials and electroless Cu deposition solution under different treatment solution temperatures and times.

AB - This study is directed towards the investigation of the compatibility between promising low-k materials and the electroless Cu deposition developed for sub-quarter-micron interconnect applications. The low-k materials used include two fluorinated polyimides, FPI-45M and FPI-136M. Fourier infrared (FTIR) spectroscopy is used to examine the possible chemical reactions between the low-k materials and electroless Cu deposition solution under different treatment solution temperatures and times.

UR - http://www.scopus.com/inward/record.url?scp=0033189125&partnerID=8YFLogxK

U2 - 10.1023/A:1006669728715

DO - 10.1023/A:1006669728715

M3 - מאמר

AN - SCOPUS:0033189125

VL - 18

SP - 1465

EP - 1467

JO - Journal of Materials Science Letters

JF - Journal of Materials Science Letters

SN - 0261-8028

IS - 18

ER -

Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment

Abstract

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