Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment

D. T. Hsu*, F. G. Shi, S. Lopatin, Y. Shacham-Diamand, B. Zhao, M. Brongo, P. K. Vasudev

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This study is directed towards the investigation of the compatibility between promising low-k materials and the electroless Cu deposition developed for sub-quarter-micron interconnect applications. The low-k materials used include two fluorinated polyimides, FPI-45M and FPI-136M. Fourier infrared (FTIR) spectroscopy is used to examine the possible chemical reactions between the low-k materials and electroless Cu deposition solution under different treatment solution temperatures and times.

Original languageEnglish
Pages (from-to)1465-1467
Number of pages3
JournalJournal of Materials Science Letters
Volume18
Issue number18
DOIs
StatePublished - 1 Jan 1999
Externally publishedYes

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