| Original language | English |
|---|---|
| Pages (from-to) | 471-474 |
| Number of pages | 4 |
| Journal | Quintessence International |
| Volume | 18 |
| Issue number | 7 |
| State | Published - Jul 1987 |
Bond strength of mechanically condensed repaired high-copper amalgam.
M. Gordon*, A. Ben-Amar, S. Librus, R. Liberman
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
15
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