Augmentation of Volume-Surface Integral Equations for Low-Frequency Modeling of Interconnect Structures

Li Zhang, Yu Zhang, Amir Boag, Mei Song Tong*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Interconnect structures include both conducting and penetrable media and electromagnetic (EM) modeling and analysis for them require the use of volume-surface integral equations (VSIEs) in the integral equation approach. The VSIEs include the L operator in both surface integral equations (SIEs) and volume integral equations (VIEs), and it will produce a low-frequency-breakdown (LFB) problem for low-frequency modeling. Although the augmentations of SIEs for both conducting and dielectric media have been proposed for remedying the LFB problem, the augmentation for the VSIEs has not been addressed yet. This paper aims to this problem and proposes an augmented VSIEs (AVSIEs) by introducing the magnetic charge density and continuity equation of magnetic current density. A numerical example is provided to demonstrate the approach and its effectiveness has been validated.

Original languageEnglish
Title of host publication2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1843-1844
Number of pages2
ISBN (Electronic)9781665442282
DOIs
StatePublished - 2023
Event2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Portland, United States
Duration: 23 Jul 202328 Jul 2023

Publication series

NameIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Volume2023-July
ISSN (Print)1522-3965

Conference

Conference2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023
Country/TerritoryUnited States
CityPortland
Period23/07/2328/07/23

Funding

FundersFunder number
International Collaboration Project of Shanghai Committee of Science and Technology, Shanghai, China21500714400

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