Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator

Ido E. Dotan; Damian Goldring; David Mendlovic

doi:10.1109/EEEI.2006.321085

Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator

Ido E. Dotan, Damian Goldring, David Mendlovic

School of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper we describe the design, fabrication and analysis of a directional coupler using sub micron SOI waveguides. Specifically, we focus on couplers featuring sub 100nm waveguide separation. Several phenomena that occur due to the ultra small gap are examined. We show that the etching rate at the waveguides gap is decreased and as a consequence the coupling between the waveguides is enhanced. Three dimensional numerical simulations are presented as well as fabrication results.

Original language	English
Title of host publication	2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI
Pages	71-73
Number of pages	3
DOIs	https://doi.org/10.1109/EEEI.2006.321085
State	Published - 2006
Event	2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI - Eilat, Israel Duration: 15 Nov 2006 → 17 Nov 2006

Publication series

Name	IEEE Convention of Electrical and Electronics Engineers in Israel, Proceedings

Conference

Conference	2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI
Country/Territory	Israel
City	Eilat
Period	15/11/06 → 17/11/06

Keywords

Directional coupler
Enhanced coupling effect
Nano
Photonics
SOI

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10.1109/EEEI.2006.321085

Cite this

Dotan, I. E., Goldring, D., & Mendlovic, D. (2006). Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator. In 2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI (pp. 71-73). [4115248] (IEEE Convention of Electrical and Electronics Engineers in Israel, Proceedings). https://doi.org/10.1109/EEEI.2006.321085

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title = "Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator",

abstract = "In this paper we describe the design, fabrication and analysis of a directional coupler using sub micron SOI waveguides. Specifically, we focus on couplers featuring sub 100nm waveguide separation. Several phenomena that occur due to the ultra small gap are examined. We show that the etching rate at the waveguides gap is decreased and as a consequence the coupling between the waveguides is enhanced. Three dimensional numerical simulations are presented as well as fabrication results.",

keywords = "Directional coupler, Enhanced coupling effect, Nano, Photonics, SOI",

author = "Dotan, {Ido E.} and Damian Goldring and David Mendlovic",

year = "2006",

doi = "10.1109/EEEI.2006.321085",

language = "אנגלית",

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series = "IEEE Convention of Electrical and Electronics Engineers in Israel, Proceedings",

pages = "71--73",

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note = "2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI ; Conference date: 15-11-2006 Through 17-11-2006",

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Dotan, IE, Goldring, D & Mendlovic, D 2006, Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator. in 2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI., 4115248, IEEE Convention of Electrical and Electronics Engineers in Israel, Proceedings, pp. 71-73, 2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI, Eilat, Israel, 15/11/06. https://doi.org/10.1109/EEEI.2006.321085

Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator. / Dotan, Ido E.; Goldring, Damian; Mendlovic, David.
2006 IEEE 24th Convention of Electrical and Electronics Engineers in Israel, IEEEI. 2006. p. 71-73 4115248 (IEEE Convention of Electrical and Electronics Engineers in Israel, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - In this paper we describe the design, fabrication and analysis of a directional coupler using sub micron SOI waveguides. Specifically, we focus on couplers featuring sub 100nm waveguide separation. Several phenomena that occur due to the ultra small gap are examined. We show that the etching rate at the waveguides gap is decreased and as a consequence the coupling between the waveguides is enhanced. Three dimensional numerical simulations are presented as well as fabrication results.

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Analysis and fabrication of sub micron scale directional coupler in high-index silicon-on-insulator

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Keywords

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