TY - GEN
T1 - An ultrasonic, electrically isolated channel, over PCB
AU - Mets, Denis
AU - Ozeri, Shaul
AU - Shmilovitz, Doron
PY - 2007
Y1 - 2007
N2 - Ceramic materials with enhanced piezoelectric characteristics became widely available in recent years, which has led to an ever-increasing employment of these devices in various applications, such as: sensing, energy harvesting and ultrasonic transducers, among others. This paper describes an acoustic link on an electronic circuit's PCB that offers isolation and high immunity from EMI. This type of coupling may be adapted to such applications as isolated switched-mode power supplies, high voltage current probes and data transfer. A further application might be the acoustic coupling of electrically isolated circuits. A recent research article reported an attempt to use acoustic transfer for electrical isolation incorporating devices designed specifically for the media through which the acoustic wave propagates, in effect creating a piezoelectric transformer. However, they observed notable limitations such as a low Common Mode Rejection Ratio (CMRR) and a relatively narrow bandwidth [1]. In the current research, several system configurations with high CMRR, low voltage input and wide bandwidth were analyzed and their relative efficiencies evaluated. A signal was transmitted using piezoelectric devices through conventional PCBs (FR4) with different thicknesses. FM modulation proved quite effective for this purpose. We also optimized a design for a relevant practical application - a switched mode power supply feedback signal coupling. The simulation was carried out using PSPICE. As there was almost no performance impairment compared to conventional electronic links, the investigation shows the benefits of the proposed acoustic link technique in systems in which a bandwidth of up to 100kH is required.
AB - Ceramic materials with enhanced piezoelectric characteristics became widely available in recent years, which has led to an ever-increasing employment of these devices in various applications, such as: sensing, energy harvesting and ultrasonic transducers, among others. This paper describes an acoustic link on an electronic circuit's PCB that offers isolation and high immunity from EMI. This type of coupling may be adapted to such applications as isolated switched-mode power supplies, high voltage current probes and data transfer. A further application might be the acoustic coupling of electrically isolated circuits. A recent research article reported an attempt to use acoustic transfer for electrical isolation incorporating devices designed specifically for the media through which the acoustic wave propagates, in effect creating a piezoelectric transformer. However, they observed notable limitations such as a low Common Mode Rejection Ratio (CMRR) and a relatively narrow bandwidth [1]. In the current research, several system configurations with high CMRR, low voltage input and wide bandwidth were analyzed and their relative efficiencies evaluated. A signal was transmitted using piezoelectric devices through conventional PCBs (FR4) with different thicknesses. FM modulation proved quite effective for this purpose. We also optimized a design for a relevant practical application - a switched mode power supply feedback signal coupling. The simulation was carried out using PSPICE. As there was almost no performance impairment compared to conventional electronic links, the investigation shows the benefits of the proposed acoustic link technique in systems in which a bandwidth of up to 100kH is required.
KW - Acoustic link
KW - Control
KW - Feedback
KW - Isolation
KW - Piezoelectric
KW - Power converter
UR - http://www.scopus.com/inward/record.url?scp=46449124756&partnerID=8YFLogxK
U2 - 10.1109/APEX.2007.357738
DO - 10.1109/APEX.2007.357738
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AN - SCOPUS:46449124756
SN - 1424407133
SN - 9781424407132
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 1639
EP - 1643
BT - APEC 2007 - 22nd Annual IEEE Applied Power Electronics Conference and Exposition
Y2 - 25 February 2007 through 1 March 2007
ER -