TY - GEN
T1 - An experimental study on the side-opening filling process at the interface between microchannels with different widths
AU - Xie, Fei
AU - Wang, Yunshan
AU - Wang, Wei
AU - Wu, Wengang
AU - Li, Zhihong
AU - Yossifon, Gilad
AU - Chang, Hsueh Chia
PY - 2011
Y1 - 2011
N2 - Micro/nanochannel is of great importance due to its wide applications in micro total analysis system. In a given micro/nanofluidic device, the nanochannel and microchannel can works as function provider and reagent delivering passage, respectively. The easiest way to fabricate micro/nanochannel is depositing material onto a predefined microchannel until nanometer-sized pattern is obtained. Although the deposition process inside the microchannel has been studied before, the filling performance at the side-opening, the connection between microchannels with different widths, is limited studied. The different filling performance at side-opening will lead to a distinct geometrical size. In this work, side-opening filling process during a low pressure chemical vapor deposition of silicon dioxide onto pre-etched microchannels with patterns of straight, triangle and rhombus shapes was preliminarily studied. A filling factor was defined to describe the side-opening filling performance. The present results indicated that the side-opening filling will be affected by the side-opening width, the depth of the microchannel and the microchannel shape.
AB - Micro/nanochannel is of great importance due to its wide applications in micro total analysis system. In a given micro/nanofluidic device, the nanochannel and microchannel can works as function provider and reagent delivering passage, respectively. The easiest way to fabricate micro/nanochannel is depositing material onto a predefined microchannel until nanometer-sized pattern is obtained. Although the deposition process inside the microchannel has been studied before, the filling performance at the side-opening, the connection between microchannels with different widths, is limited studied. The different filling performance at side-opening will lead to a distinct geometrical size. In this work, side-opening filling process during a low pressure chemical vapor deposition of silicon dioxide onto pre-etched microchannels with patterns of straight, triangle and rhombus shapes was preliminarily studied. A filling factor was defined to describe the side-opening filling performance. The present results indicated that the side-opening filling will be affected by the side-opening width, the depth of the microchannel and the microchannel shape.
KW - Filling factor
KW - Micro/nanochannel
KW - Side-opening filling
UR - http://www.scopus.com/inward/record.url?scp=79960796801&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.483.293
DO - 10.4028/www.scientific.net/KEM.483.293
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AN - SCOPUS:79960796801
SN - 9783037851753
T3 - Key Engineering Materials
SP - 293
EP - 296
BT - MEMS/NEMS Nano Technology
PB - Trans Tech Publications Ltd
ER -