Alumina/NiCu Laminate under Thermal Shock up to 1000°C: II, Prediction of the Laminate Behavior

In this investigation, a multilayered, multimaterial system with strong interface subjected to thermal shock loading was analyzed. The analysis was based on a one-dimensional spatiotemporal finite difference scheme of the temperature field, and the thermal residual stresses and zero misfit stress temperature were considered. Using a failure criterion based on crack initiation, the number of broken layers due to thermal shock and residual mechanical strength at room temperature could be predicted. Furthermore, the room temperature residual strength of the laminate as a function of thermal shock temperature was constructed, demonstrating steplike behavior. Using this model, the mechanical behavior of the alumina/ NiCu laminate system subjected to thermal shock loading of up to 1000°C was predicted. The model revealed the superiority of this material system over monolithic ceramics under thermal shock conditions.