Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Yosi Shacham-Diamand (Editor), Tetsuya Osaka (Editor), Madhav Datta (Editor), Takayuki Ohba (Editor)

Research output: Book/ReportBook


Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.
Original languageEnglish
Place of PublicationNew York, NY
PublisherSpringer New York; Imprint: Springer
Number of pages544
Edition1st ed. 2009
ISBN (Electronic)0387958681, 978-0-387-95868-2
ISBN (Print)978-0-387-95867-5
StatePublished - 2009

ULI Keywords

  • uli
  • Chemical engineering
  • Electrical engineering
  • Electrochemistry
  • Materials science
  • Nanotechnology
  • הנדסת חשמל
  • אלקטרוכימיה
  • ננוטכנולוגיה
  • Chemistry, Industrial
  • Engineering, Chemical
  • Industrial chemistry -- Chemical engineering
  • Electric engineering
  • Material science
  • Molecular technology
  • Nanoscale technology


Dive into the research topics of 'Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications'. Together they form a unique fingerprint.

Cite this