Advanced Metallization Conference 2010 a conference in two sites: AMC 2010 - Albany, NY, October 5-7, 2010 and the ADMETA 2010 - Tokyo, October 19-22, 2010

Yosi Shacham-Diamand; R. V. Joshi

doi:10.1016/j.mee.2012.03.001

Advanced Metallization Conference 2010 a conference in two sites: AMC 2010 - Albany, NY, October 5-7, 2010 and the ADMETA 2010 - Tokyo, October 19-22, 2010

Yosi Shacham-Diamand^*, R. V. Joshi

^*Corresponding author for this work

School of Electrical Engineering

IBM

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	1-2
Number of pages	2
Journal	Microelectronic Engineering
Volume	92
DOIs	https://doi.org/10.1016/j.mee.2012.03.001
State	Published - Apr 2012

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10.1016/j.mee.2012.03.001

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title = "Advanced Metallization Conference 2010 a conference in two sites: AMC 2010 - Albany, NY, October 5-7, 2010 and the ADMETA 2010 - Tokyo, October 19-22, 2010",

author = "Yosi Shacham-Diamand and Joshi, {R. V.}",

note = "Funding Information: The Advanced Metallization Conference 2010, 20th Asian Session: ADMETA 2010 was organized to stimulate and enhance the research and development of ULSI interconnect technology; and each year since 1989 the conference has been held at about the same time in both Japan and USA, and has showcased remarkable interconnect technology development in Asia. The theme of the 2010{\textquoteright}s workshop was “3-Dimensional Interconnect Technology”. The ADMETA 2010 meeting was Sponsored by The Japan Society of Applied Physics and Supported by the Surface Finishing Society of Japan, The Institute of Electrical Engineers of Japan, The Japan Society for Precision Engineering, the Institute of Electronics, Information and Communication Engineers, the Japan Institute of Metals, IEEE EDS Japan Chapter, the Vacuum Society of Japan, and The Surface Science Society of Japan. ",

year = "2012",

month = apr,

doi = "10.1016/j.mee.2012.03.001",

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AU - Shacham-Diamand, Yosi

AU - Joshi, R. V.

N1 - Funding Information: The Advanced Metallization Conference 2010, 20th Asian Session: ADMETA 2010 was organized to stimulate and enhance the research and development of ULSI interconnect technology; and each year since 1989 the conference has been held at about the same time in both Japan and USA, and has showcased remarkable interconnect technology development in Asia. The theme of the 2010’s workshop was “3-Dimensional Interconnect Technology”. The ADMETA 2010 meeting was Sponsored by The Japan Society of Applied Physics and Supported by the Surface Finishing Society of Japan, The Institute of Electrical Engineers of Japan, The Japan Society for Precision Engineering, the Institute of Electronics, Information and Communication Engineers, the Japan Institute of Metals, IEEE EDS Japan Chapter, the Vacuum Society of Japan, and The Surface Science Society of Japan.

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Advanced Metallization Conference 2010 a conference in two sites: AMC 2010 - Albany, NY, October 5-7, 2010 and the ADMETA 2010 - Tokyo, October 19-22, 2010

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