Accurate Modeling of Directional Couplers With Oxide Cladding: Bridging Simulation and Experiment

Yuval Warshavsky*, Yehonathan Drori, Jonatan Piasetzky, Amit Rotem, Ofer Shapiro, Yaron Oz, Haim Suchowski

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Directional couplers are a fundamental building block in integrated photonics, particularly in quantum applications and optimization-based design where precision is critical. Accurate functionality is crucial to ensure reliable operation within classical and quantum circuits. However, discrepancies between simulations and measurements are frequently observed. These inaccuracies can compromise the performance and scalability of integrated photonic systems, underscoring the critical need for advanced, precise simulation methods that bridge the gap between design and implementation. In this work, we show that this discrepancy can be mainly attributed to density changes in the oxide cladding. We conduct a systematic study involving experimental optical measurements, numerical simulations, and direct electron microscopy imaging to investigate this discrepancy in directional couplers. We find that the impact of cladding density variations on performance increases as feature gaps shrink. By incorporating these effects into our simulations using a novel and physically motivated Effective Trench Medium Model (ETMM), we achieve highly accurate reproduction of experimental measurements. We quantify the effects of cladding density variations on the SU(2) symmetry parameters that govern light propagation in directional couplers. This insight is crucial for advancing the precision of compact device fabrication, enabling reliable simulation of photonic integrated devices.

Original languageEnglish
Pages (from-to)7233-7238
Number of pages6
JournalJournal of Lightwave Technology
Volume43
Issue number15
DOIs
StatePublished - 2025

Funding

FundersFunder number
Applied Nanotools Inc.
Israel Science Foundation2312/21, 3427/21

    Keywords

    • Directional coupler
    • Effective trench medium model
    • integrated photonics
    • oxide cladding
    • quantum integrated circuits
    • silicon-on-insulator
    • void

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