A Wafer Level Packaged Fully Integrated Hyperspectral Fabry-Perot Filter with Extended Optical Range

Peleg Levin, Eli Ashkenazy, Ariel Raz, Miriam Hershcovitz, Siebe Bouwstra, David Mendlovic, Slava Krylov

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

We report on the first demonstration of a wafer level packaged, vacuum sealed, fully integrated and cell-phone compatible tunable micromachined Fabry-Pérot filter (\mu \mathrm{FPF}), operating within the visual and near-infrared (VIS-NIR) optical range. Implementation of a normally closed architecture combined with the electrostatic actuation enlarging, rather than closing, the optical cavity allowed unprecedented tunability of the optical gap between 600 nm and down to potentially 30 nm. The ability to support such a small gap size enables, for the first time, a transparent mode to such filters. Due to the 1 mm thickness of a vertically integrated Si-on-glass (SOG) fully assembled device, manufacturability and robustness of a single crystal Si mechanical structure, and its short response time, our hyperspectral filter can be directly integrated into mobile phone camera modules, hyperspectral imagers, and remote sensors.

Original languageEnglish
Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages270-273
Number of pages4
ISBN (Electronic)9781728116105
DOIs
StatePublished - Jan 2019
Event32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019 - Seoul, Korea, Republic of
Duration: 27 Jan 201931 Jan 2019

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2019-January
ISSN (Print)1084-6999

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Country/TerritoryKorea, Republic of
CitySeoul
Period27/01/1931/01/19

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