TY - GEN
T1 - A Wafer Level Packaged Fully Integrated Hyperspectral Fabry-Perot Filter with Extended Optical Range
AU - Levin, Peleg
AU - Ashkenazy, Eli
AU - Raz, Ariel
AU - Hershcovitz, Miriam
AU - Bouwstra, Siebe
AU - Mendlovic, David
AU - Krylov, Slava
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - We report on the first demonstration of a wafer level packaged, vacuum sealed, fully integrated and cell-phone compatible tunable micromachined Fabry-Pérot filter (\mu \mathrm{FPF}), operating within the visual and near-infrared (VIS-NIR) optical range. Implementation of a normally closed architecture combined with the electrostatic actuation enlarging, rather than closing, the optical cavity allowed unprecedented tunability of the optical gap between 600 nm and down to potentially 30 nm. The ability to support such a small gap size enables, for the first time, a transparent mode to such filters. Due to the 1 mm thickness of a vertically integrated Si-on-glass (SOG) fully assembled device, manufacturability and robustness of a single crystal Si mechanical structure, and its short response time, our hyperspectral filter can be directly integrated into mobile phone camera modules, hyperspectral imagers, and remote sensors.
AB - We report on the first demonstration of a wafer level packaged, vacuum sealed, fully integrated and cell-phone compatible tunable micromachined Fabry-Pérot filter (\mu \mathrm{FPF}), operating within the visual and near-infrared (VIS-NIR) optical range. Implementation of a normally closed architecture combined with the electrostatic actuation enlarging, rather than closing, the optical cavity allowed unprecedented tunability of the optical gap between 600 nm and down to potentially 30 nm. The ability to support such a small gap size enables, for the first time, a transparent mode to such filters. Due to the 1 mm thickness of a vertically integrated Si-on-glass (SOG) fully assembled device, manufacturability and robustness of a single crystal Si mechanical structure, and its short response time, our hyperspectral filter can be directly integrated into mobile phone camera modules, hyperspectral imagers, and remote sensors.
UR - http://www.scopus.com/inward/record.url?scp=85074347443&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2019.8870831
DO - 10.1109/MEMSYS.2019.8870831
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AN - SCOPUS:85074347443
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 270
EP - 273
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -