@inbook{d61e90bc3c224e9c8ebade6b6c4bea09,
title = "A Thermoelastic Failure Criterion at the Micron Scale in Electronic Devices",
abstract = "Here we demonstrate the application of the SED failure criterion to a “real-life” engineering problem involving thermoelasticity effects in a microscale electronic device discussed in [205]. The fabrication of microelectronic devices (chips) is a multistep process aimed at creating a layered structure made of semiconductors, metals, and insulators.",
keywords = "Failure Criterion, Metal Line, Micron Scale, Passivation Layer, Plasma Power",
author = "Zohar Yosibash",
note = "Publisher Copyright: {\textcopyright} 2012, Springer Science+Business Media, LLC.",
year = "2012",
doi = "10.1007/978-1-4614-1508-4_9",
language = "אנגלית",
series = "Interdisciplinary Applied Mathematics",
publisher = "Springer Nature",
pages = "221--236",
booktitle = "Interdisciplinary Applied Mathematics",
address = "ארצות הברית",
}