A Thermoelastic Failure Criterion at the Micron Scale in Electronic Devices

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

Here we demonstrate the application of the SED failure criterion to a “real-life” engineering problem involving thermoelasticity effects in a microscale electronic device discussed in [205]. The fabrication of microelectronic devices (chips) is a multistep process aimed at creating a layered structure made of semiconductors, metals, and insulators.

Original languageEnglish
Title of host publicationInterdisciplinary Applied Mathematics
PublisherSpringer Nature
Pages221-236
Number of pages16
DOIs
StatePublished - 2012
Externally publishedYes

Publication series

NameInterdisciplinary Applied Mathematics
Volume37
ISSN (Print)0939-6047
ISSN (Electronic)2196-9973

Keywords

  • Failure Criterion
  • Metal Line
  • Micron Scale
  • Passivation Layer
  • Plasma Power

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