A novel spiral CMOS compatible micromachined thermoelectric IR microsensor

E. Socher*, O. Bochobza-Degani, Y. Nemirovsky

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


A novel sensing structure and realization method is proposed for complementary metal-oxide semiconductor (CMOS) compatible thermoelectric uncooled infrared microsensors. The structure enables high sensitivity and excellent thermal isolation in sensor pixels with small dimensions suitable for two-dimensional thermal imaging. Front-side dry micromachining allows fast CMOS post-processing, small pixel pitch and integration with on-chip CMOS readout. Prototype sensors with an area of 70 × 70 μm2 achieved a measured noise equivalent power of 0.36 nW Hz-1/2 and a response time of 3 ms.

Original languageEnglish
Pages (from-to)574-576
Number of pages3
JournalJournal of Micromechanics and Microengineering
Issue number5
StatePublished - Sep 2001
Externally publishedYes


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