TY - GEN
T1 - A Multi-Functional Organic Electronic Smart Material
AU - Bardea, Amos
AU - Axelevitch, Alexander
AU - Patolsky, Fernando
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Materials that possess multiple properties and functionalities, which can be controlled or modulated by external stimuli, are a recent central focus in the field of material sciences. Here, we demonstrate a multifunctional smart composite material made from polydimethylsiloxane and polypyrrole, doped by nickel nanoparticles. Negative organic magnetoresistance is observed. The polydimethylsiloxane and polypyrrole composite doped by nickel nanoparticles displays an electrical response that depends on temperature, strain, and bending. These promising results may lead to the wide range future application of this multifunctional composite material in biomedical, lab-on a-chip, magnetic-switch, sensors, transistor and organic spintronic devices.
AB - Materials that possess multiple properties and functionalities, which can be controlled or modulated by external stimuli, are a recent central focus in the field of material sciences. Here, we demonstrate a multifunctional smart composite material made from polydimethylsiloxane and polypyrrole, doped by nickel nanoparticles. Negative organic magnetoresistance is observed. The polydimethylsiloxane and polypyrrole composite doped by nickel nanoparticles displays an electrical response that depends on temperature, strain, and bending. These promising results may lead to the wide range future application of this multifunctional composite material in biomedical, lab-on a-chip, magnetic-switch, sensors, transistor and organic spintronic devices.
KW - Magnetoresistance
KW - Organic Electronic
KW - Organic spintronic
KW - Smart Materials
KW - style
UR - http://www.scopus.com/inward/record.url?scp=85171531528&partnerID=8YFLogxK
U2 - 10.1109/FLEPS57599.2023.10220411
DO - 10.1109/FLEPS57599.2023.10220411
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AN - SCOPUS:85171531528
T3 - FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
BT - FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023
Y2 - 9 July 2023 through 12 July 2023
ER -