A low-cost CMOS compatible serpentine-structured polysilicon-based microbolometer array

E. Socher*, Y. Sinai, Y. Nemirovsky

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

This work reports the design, fabrication and initial characterization of novel low-cost CMOS compatible microbolometers and a 16∗16 demonstration focal plane array based on the new technology. The bolometers are fabricated as part of a standard CMOS process with maskless postprocessing that includes frontside isotropic silicon dry etching in order to release the serpentine microstructures of the bolometers. FPA readout is based on differential current integration per column with an internal 5bit DAC for non-uniformity correction of each pixel. Fabricated devices are measured and compared with design and simulation.

Original languageEnglish
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages320-323
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
StatePublished - 2003
Externally publishedYes
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: 8 Jun 200312 Jun 2003

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume1

Conference

Conference12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
Country/TerritoryUnited States
CityBoston
Period8/06/0312/06/03

Keywords

  • Bolometers
  • CMOS process
  • Circuits
  • Dielectrics
  • Fabrication
  • Resistors
  • Sensor arrays
  • Silicon
  • Thermal resistance
  • Thermal sensors

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