A 1.3 Tb/s parallel optics VCSEL link

Kobi Hasharoni, Shuki Benjamin, Amir Geron, Stanislav Stepanov, Gideon Katz, Itai Epstein, Niv Margalit, David Chairman, Michael Mesh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measured with BER < 10-12 while the power efficiency is 10.2 pJ/bit. The interconnect design is that of hybrid device with the III-V optoelectronics assembled directly onto the ASIC using Au/Sn eutectic bonding. Optical packaging is enabled using fiber bundle matrices whose dimensions are identical to those of the optoelectronic chips. The entire chip is assembled onto a system PCB in telecom and datacom applications. The backplane of the system becomes passive optical backplane and is entirely fiber based. The hybrid integration allows for a 3-fold increase in the number of SerDes available on a single package to about 500 lanes.

Original languageEnglish
Title of host publicationOptical Interconnects XIV
PublisherSPIE
ISBN (Print)9780819499042
DOIs
StatePublished - 2014
Externally publishedYes
EventOptical Interconnects XIV - San Francisco, CA, United States
Duration: 3 Feb 20145 Feb 2014

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8991
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceOptical Interconnects XIV
Country/TerritoryUnited States
CitySan Francisco, CA
Period3/02/145/02/14

Keywords

  • III-V on CMOS
  • Optical interconnect
  • Optical package
  • Parallel optics
  • VCSEL

Fingerprint

Dive into the research topics of 'A 1.3 Tb/s parallel optics VCSEL link'. Together they form a unique fingerprint.

Cite this