@inproceedings{545bf891dea843f1b73099de3fe278e3,
title = "80kHz as an alternate frequency for large aluminum wire bonding",
abstract = "Traditionally, Orthodyne Electronics has used a frequency of60,000 Hertz (60kHz) for large diameter wedge bonding. Recently, there has been some evaluation of different frequencies to determine if they could solve some intermittent issues encountered during the wire bonding process. Orthodyne Electronics test data and three case studies in which an 80kHz transducer produced better results, will be reviewed. It was found that 80kHz either solved sporadic bonding problems due to resonance phenomena in the 60kHz range or simply increased throughput by using less bond time. Other potential benefits with converting to 80kHz will be explained, such as: slower build-up on the bond tool and using less power (which could result in less cratering and micro-cracks of silicon die). This paper will review that there are alternative- frequencies for large diameter aluminum wire (5 to 25 mils) and that 80kHz is a workable option.",
keywords = "Aluminum, Frequency, Wedge bonding, Wire bonding",
author = "Mike McKeown and Alex Voronel",
year = "2006",
language = "אנגלית",
isbn = "0930815807",
series = "Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006",
pages = "695--702",
booktitle = "Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006",
note = "39th International Symposium on Microelectronics, IMAPS 2006 ; Conference date: 08-10-2006 Through 12-10-2006",
}