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80kHz as an alternate frequency for large aluminum wire bonding

  • Mike McKeown*
  • , Alex Voronel
  • *Corresponding author for this work
  • Orthodyne Electronics

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Traditionally, Orthodyne Electronics has used a frequency of60,000 Hertz (60kHz) for large diameter wedge bonding. Recently, there has been some evaluation of different frequencies to determine if they could solve some intermittent issues encountered during the wire bonding process. Orthodyne Electronics test data and three case studies in which an 80kHz transducer produced better results, will be reviewed. It was found that 80kHz either solved sporadic bonding problems due to resonance phenomena in the 60kHz range or simply increased throughput by using less bond time. Other potential benefits with converting to 80kHz will be explained, such as: slower build-up on the bond tool and using less power (which could result in less cratering and micro-cracks of silicon die). This paper will review that there are alternative- frequencies for large diameter aluminum wire (5 to 25 mils) and that 80kHz is a workable option.

Original languageEnglish
Title of host publicationProceedings - 2006 International Symposium on Microelectronics, IMAPS 2006
Pages695-702
Number of pages8
StatePublished - 2006
Externally publishedYes
Event39th International Symposium on Microelectronics, IMAPS 2006 - San Diego, CA, United States
Duration: 8 Oct 200612 Oct 2006

Publication series

NameProceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Conference

Conference39th International Symposium on Microelectronics, IMAPS 2006
Country/TerritoryUnited States
CitySan Diego, CA
Period8/10/0612/10/06

Keywords

  • Aluminum
  • Frequency
  • Wedge bonding
  • Wire bonding

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