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100 nm wide copper lines made by selective electroless deposition
Yosi Shacham-Diamand
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Engineering & Materials Science
Electroless plating
100%
Copper
60%
Ions
15%
Ammonium hydroxide
13%
Electron beam lithography
12%
Polymethyl methacrylates
10%
Formaldehyde
10%
Sodium hydroxide
9%
Topography
9%
Silica
8%
Electrons
8%
Aspect ratio
7%
Integrated circuits
7%
Vapors
7%
Fabrication
6%
Chemistry
pH Value
31%
Silicon Dioxide
30%
Basic Solution
29%
Electron Beam
26%
Neutralization
25%
Sodium Hydroxide
23%
Dielectric Material
21%
Formaldehyde
21%
Hydroxyl
20%
Ion
19%
Electron Particle
13%
Reduction
11%