1980 …2024

Research activity per year

Network

Alexandra Inberg

Person: Retired

Judith Rishpon

Person: Retired

Michael Golub

Person: Researcher

Yaron Niv

Person: Retired

Yelena Sverdlov

  • Tel Aviv University

External person

N. Croitoru

  • Tel Aviv University
  • United States Food and Drug Administration
  • Rabin Medical Center Israel
  • National Institute for Nuclear Physics
  • IEEE
  • Georgia Institute of Technology
  • Department of Electron Devices and Materials and Electromagnetic Radiation
  • Department of Electronic Devices and Materials and Electromagnetic Radiation

External person

H. Ben-Yoav

  • Tel Aviv University
  • University of Maryland, College Park
  • Faculty of Engineering
  • Ben-Gurion University of the Negev

External person

S. Belkin

  • Tel Aviv University
  • Hebrew University of Jerusalem
  • Enzymit Ltd. 3 Pinhas Sapir St

External person

N. Fishelson

  • Tel Aviv University
  • Department of Electrical Engineering Faculty of Engineering

External person

V. Bogush

  • Tel Aviv University
  • Belarusian State University of Informatics and Radioelectronics

External person

Tetsuya Osaka

  • Waseda University
  • The Electrochemical Society

External person

Boaz Eitan

  • Saifun Semiconductors Ltd.
  • IEEE
  • Tel Aviv University

External person

Valery M. Dubin

  • Advanced Micro Devices
  • Intel
  • Nano3D Systems LLC.
  • National Nanofabrication Facility at Cornell
  • Cornell University

External person

Eliezer Gileadi

  • Tel Aviv University
  • The Electrochemical Society

External person

Olga Berkh

  • Tel Aviv University

External person

W. G. Oldham

  • University of California at Berkeley
  • Cornell University

External person

M. Eizenberg

  • Technion-Israel Institute of Technology

External person

Assaf Shappir

  • Saifun Semiconductors Ltd.
  • Tel Aviv University

External person

Eli Lusky

  • Tel Aviv University
  • Saifun Semiconductors Ltd.
  • Nano-Sci./Nano-Technology Project

External person

Ilan Bloom

  • Saifun Semiconductors Ltd.
  • IEEE
  • Tel Aviv University

External person

Leeya Engel

  • Tel Aviv University
  • Stanford University
  • Stanford University

External person

M. Sternheim

  • Tel Aviv University

External person

Danilo Demarchi

  • Polytechnic University of Turin
  • Tel Aviv University

External person

S. Lopatin

  • Cornell University
  • Advanced Micro Devices

External person

Hila Einati

  • Tel Aviv University

External person

A. Biran

  • Tel Aviv University
  • Hebrew University of Jerusalem

External person

Amit Ron

  • Tel Aviv University
  • Department of Electrical Engineering Faculty of Engineering

External person

Sefi Vernick

  • Agricultural Research Organization of Israel
  • Tel Aviv University
  • Israel Ministry of Agriculture and Rural Development

External person

P. K. Vasudev

  • SEMATECH
  • Cornell University

External person

J. W. Mayer

  • Cornell University
  • Arizona State University

External person

Marios Sophocleous

  • University of Cyprus
  • Tel Aviv University
  • EBOS Technologies Ltd.

External person

J. Shklovsky

  • Tel Aviv University

External person

P. Livshits

  • Bar-Ilan University
  • Tel Aviv University
  • Freescale Semiconductor

External person

Julius Georgiou

  • University of Cyprus

External person

Ramiz Daniel

  • Tel Aviv University
  • TOWER Semiconductor Ltd.
  • Technion-Israel Institute of Technology

External person

E. Glickman

  • Tel Aviv University
  • Hebrew University of Jerusalem

External person

Tal Yoetz-Kopelman

  • Tel Aviv University

External person

R. Ofek Almog

  • Tel Aviv University
  • Holon Institute of Technology

External person

Zeev Zalevsky

  • Bar-Ilan University
  • Alabama A and M University
  • Civcom Devices and Systems Inc.
  • Friedrich-Alexander University Erlangen-Nürnberg
  • University of Valencia
  • ContinUse Biometrics Ltd.
  • Formerly Contin Use Biometrics Ltd
  • Donisi Health (Formerly ContinUse Biometrics Ltd.)
  • Tel Aviv University

External person

Rakefet Ofek Almog

  • Tel Aviv University
  • Azrieli College of Engineering
  • Azrieli Academic College of Engineering
  • Azrieli College of Engineering

External person

Rachela Popovtzer

  • Tel Aviv University
  • Bar-Ilan University
  • University of Michigan, Ann Arbor

External person

Masahiro Yoshino

  • Waseda University
  • The Electrochemical Society

External person

Tal Elad

  • Hebrew University of Jerusalem

External person

Salvo Mirabella

  • University of Catania

External person

D. Horvitz

  • Micron Israel Ltd.
  • Micron Semiconductors Israel Ltd.
  • Tel Aviv University
  • Numonyx Israel Ltd.
  • Thermo Fisher Scientific, Inc.

External person

Dana Ashkenazi

  • Tel Aviv University
  • The Fleischman Fac. of Engineering
  • The Dreszer Fracture Mechanics Lab.

External person

Yuri Rosenberg

  • Tel Aviv University
  • School of Chemistry
  • Tel Aviv 69978
  • Rabin Medical Center Israel
  • Ultrasound Div., Rabin Med. C.

External person

Nofar Mintz Hemed

  • Tel Aviv University

External person

R. Pedahzur

  • Tel Aviv University
  • Hebrew University of Jerusalem

External person

Ilan Blech

  • Zoran Corp
  • Technion-Israel Institute of Technology
  • Zoran Corp.

External person

A. Duhin

  • Tel Aviv University

External person

Arthur Rabner

  • Tel Aviv University

External person

N. Petrov

  • Tel Aviv University
  • Mattson Technology, Inc.

External person

Ragini Raj Singh

  • Tel Aviv University
  • Department of Electrical Engineering Faculty of Engineering

External person

Irena Shur

  • Tel Aviv University

External person

Georg Reifferscheid

  • German Federal Institute of Hydrology

External person

Z. Kotler

  • Electro-Optics Division
  • Orbotech Ltd.
  • Tel Aviv University

External person

Noel M. Elman

  • Tel Aviv University
  • Massachusetts Institute of Technology
  • Massachusetts Institute of Technology

External person

A. Kepten

  • ColorChip Inc.
  • Tel Aviv University
  • Semi-Conductor Devices Inc. (Israel)
  • SemiConductor Devices
  • Technion-Israel Institute of Technology

External person

R. Ofek Almog

  • Tel Aviv University
  • Azrieli College of Engineering

External person

Paolo Motto Ros

  • Polytechnic University of Turin
  • Italian Institute of Technology

External person

Annalisa Convertino

  • National Research Council of Italy

External person

Sharon Yagur-Kroll

  • Hebrew University of Jerusalem

External person

E. Ginsburg

  • Tel Aviv University

External person

Sebastian Buchinger

  • German Federal Institute of Hydrology

External person

Levy Gerzberg

  • Zoran Corp
  • Technion-Israel Institute of Technology
  • Zoran Corp.

External person

Luca Maiolo

  • National Research Council of Italy

External person

Alessandro Sanginario

  • Polytechnic University of Turin

External person

B. Zhao

  • Conexant
  • Cornell University

External person

Eric Sirkin

  • Zoran Corp
  • Technion-Israel Institute of Technology
  • Zoran Corp.

External person

A. Stern

  • Ben-Gurion University of the Negev
  • Afeka Academic College of Engineering
  • Afeka Academic College of Engineering

External person

Rina Socher

  • Tel Aviv University

External person

Tova Neufeld

  • Tel Aviv University

External person

Carmit Porat-Ophir

  • Tel Aviv University

External person

Umberto Garlando

  • Polytechnic University of Turin

External person

J. M.J. Frchet

  • Cornell University

External person

P. Sutardja

  • University of California at Berkeley

External person

E. Rabinovich

  • Tel Aviv University
  • Holon Institute of Technology
  • 68102
  • National Institute for Nuclear Physics
  • Open University of Israel

External person

E. N. Shauly

  • Tower Semiconductors Ltd.
  • Technion-Israel Institute of Technology
  • TOWER Semiconductor Ltd.

External person

Sahar Melamed

  • Hebrew University of Jerusalem

External person

Larisa Burstein

  • Tel Aviv University

External person

Alex Sinar

  • Zoran Corp
  • Technion-Israel Institute of Technology
  • Zoran Corp.

External person

A. Rozenblat

  • Micron Israel Ltd.
  • Tel Aviv University
  • Numonyx Israel Ltd.
  • Micron Semiconductors Israel Ltd.

External person

I. Kidron

  • Technion-Israel Institute of Technology

External person

S. E. Schacham

  • Semi-Conductor Devices Inc. (Israel)
  • SemiConductor Devices
  • Technion-Israel Institute of Technology
  • Ariel University

External person

Yutaka Okinaka

  • Waseda University
  • The Electrochemical Society

External person

L. Zhu

  • Tel Aviv University

External person

D. Schreiber

  • Tel Aviv University

External person

H. Ragones

  • Tel Aviv University
  • Holon Institute of Technology

External person

Itsuaki Matsuda

  • Waseda University

External person

M. Aviv

  • Tel Aviv University
  • Afeka Tel Aviv Academic College of Engineering

External person

Tsvi Shmilovich

  • Tel Aviv University

External person

S. Haimson

  • Micron Israel Ltd.
  • Tel Aviv University
  • Micron Semiconductors Israel Ltd.

External person

M. Desilva

  • Cornell University
  • STMicroelectronics

External person

G. Aviram

  • Tel Aviv University

External person

Avinoam Kolodny

  • Technion-Israel Institute of Technology

External person

Alessandro Pecora

  • National Research Council of Italy

External person

Vincenzina Strano

  • University of Catania

External person

Z. Atzmon

  • Technion-Israel Institute of Technology

External person

R. J. Soave

  • Silicon Valley Group
  • Cornell University

External person

D. T. Hsu

  • University of California at Irvine
  • Conexant

External person

Madoka Hasegawa

  • Waseda University

External person

T. Momma

  • Waseda University
  • Japan Science and Technology Agency
  • The Electrochemical Society

External person

A. H. Taub

  • Tel Aviv University
  • Weizmann Institute of Science

External person

Guy Ayal

  • Tel Aviv University
  • Applied Materials Incorporated
  • TOWER Semiconductor Ltd.

External person

Ilya Torchinsky

  • Tel Aviv University

External person

Kaushik Bhaumik

  • McKinsey and Company
  • Cornell University

External person

Amit Siany

  • Applied Materials Incorporated

External person

Jian Li

  • Cornell University

External person

A. Magal

  • Tel Aviv University

External person

F. Schäffler

  • Daimler AG

External person

O. Younes

  • Tel Aviv University

External person

R. Hogri

  • Tel Aviv University

External person

J. A. Nucci

  • Cornell University

External person

N. Moriya

  • Technion-Israel Institute of Technology

External person

David Malka

  • Bar-Ilan University

External person

Andrey Shmidt

  • Tel Aviv University

External person

Yael Shur

  • Tel Aviv University

External person

A. Seidman

  • Tel Aviv University
  • National Institute for Nuclear Physics
  • University of Hamburg
  • Department of Electronic Devices and Materials and Electromagnetic Radiation

External person

T. Asher

  • Tel Aviv University

External person

F. G. Shi

  • University of California at Irvine

External person

H. Mukaibo

  • Waseda University
  • The Electrochemical Society

External person

Guglielmo Fortunato

  • National Research Council of Italy

External person

M. Brongo

  • Conexant

External person

J. Sasano

  • Waseda University

External person

Maurizio Martina

  • Polytechnic University of Turin

External person

S. M. Lee

  • Cornell University

External person

Y. Fleger

  • Bar-Ilan University

External person

Yu I. Rozenberg

  • Tel Aviv University

External person

V. Sabayev

  • Tel Aviv University

External person

Timothy Weidman

  • Applied Materials Incorporated

External person

Eran Mishuk

  • Weizmann Institute of Science

External person

Emmanuel P. Giannelis

  • Cornell University

External person

Moushumi Ghosh

  • Thapar Institute of Engineering & Technology

External person

J. Peter Krusius

  • Cornell University

External person

E. Finkman

  • Technion-Israel Institute of Technology

External person

Y. Raskin

  • Sizary Limited
  • Tel Aviv University
  • TOWER Semiconductor Ltd.

External person

Peter Dubruel

  • Ghent University

External person

P. L. Pai

  • University of California at Berkeley

External person

Arulkumar Shanmugasundram

  • Applied Materials Incorporated

External person

Roman Novitski

  • Tel Aviv University

External person

Kenneth Adesanya

  • Ghent University

External person

D. Hoffstetter

  • University of California at Berkeley
  • Cornell University

External person

J. Chen

  • Newcastle University

External person

B. E. Deal

  • Stanford University
  • Tel Aviv University
  • Sizary Limited
  • Stanford University

External person

Stefano Calvo

  • Polytechnic University of Turin

External person

Igor Lubomirsky

  • Weizmann Institute of Science

External person

F. Maita

  • National Research Council of Italy

External person

Yishay Feldman

  • Weizmann Institute of Science

External person

A. Klyuch

  • Sizary Limited

External person

Giora Kimmel

  • Ben-Gurion University of the Negev

External person

Virgil Tiponut

  • Politehnica University of Timisoara

External person

S. Roy

  • Newcastle University

External person

Yael Dror

  • Tel Aviv University

External person

Nofar Mintz-Hemed

  • Tel Aviv University

External person

H. Nara

  • Waseda University

External person

Vladimir Dergachev

  • Tel Aviv University

External person

Nathan I. Croitoriu

  • Tel Aviv University

External person

M. Beregovsky

  • Tower Semiconductor Limited
  • Stanford University
  • Stanford University

External person

M. Ben-David

  • Tel Aviv University

External person

Assaf Yaakobovitz

  • Ben-Gurion University of the Negev
  • Tel Aviv University
  • Soraski Medical Center

External person

A. Rubin

  • Tel Aviv University

External person

Yaron Ram

  • Tel Aviv University

External person

Oren Shaya

  • Tel Aviv University

External person

Chris Spence

  • Electronics Research Laboratory
  • University of California at Berkeley

External person

K. Young

  • University of California at Berkeley

External person

J. Fahey

  • Cornell University

External person

Lorenzo Migliorini

  • University of Milan

External person

Aryeh Weiss

  • Bar-Ilan University
  • Hebrew University of Jerusalem
  • Jerusalem College of Technology

External person

Richard E. Palmer

  • Swansea University
  • University of Birmingham

External person

R. Popovitz

  • Weizmann Institute of Science

External person

S. Matuszczak

  • Cornell University

External person

B. Israel

  • Tel Aviv University

External person

Matthew Angyal

  • Cornell University

External person

R. R. Keller

  • National Institute of Standards and Technology

External person

Eran Gur

  • Tel Aviv University
  • Shenkar College of Engineering and Design Israel

External person

Silvia Schuster

  • Tel Aviv University

External person

C. H. Ting

  • Cornell University
  • Advanced Micro Devices

External person

Mario Urso

  • University of Catania

External person

T. Masuda

  • The Electrochemical Society
  • Waseda University

External person

Y. S. Kim

  • Cornell University

External person

Asia Shapira

  • Tel Aviv University

External person

Tal Amzel

  • Tel Aviv University
  • CollPlant Ltd

External person

Matteo Beggiato

  • Polytechnic University of Turin

External person

J. E. Sanchez

  • University of Michigan, Ann Arbor
  • Advanced Micro Devices

External person

P. L. Pai

  • University of California at Berkeley

External person

Ran Ginosar

  • Technion-Israel Institute of Technology

External person

Mihai Emanuel Basch

  • Politehnica University of Timisoara

External person

Karun Verma

  • Thapar Institute of Engineering & Technology

External person

David Levy

  • Tel Aviv University

External person

Ramon Axelrod

  • Tel Aviv University

External person

S. J. Bull

  • Newcastle University

External person

A. Zylberman

  • Tel Aviv University

External person

Anton Belkin

  • Perm State Medical University
  • Perm Medical Academy named by acad. E. Wagner

External person

Genrietta Freynd

  • Perm State Medical University
  • Perm Medical Academy named by acad. E. Wagner

External person

David George Cristea

  • Politehnica University of Timisoara
  • Technion-Israel Institute of Technology

External person

Mikhail Katsnelson

  • Perm National Research Polytechnic University

External person

Gabor Kosa

  • Tel Aviv University
  • University of Basel
  • School of Electrical Engineering

External person

O. Adan

  • Ben-Gurion University of the Negev
  • Tel Aviv University
  • Applied Materials Incorporated

External person

Francesco Priolo

  • University of Catania

External person

A. Dedhia

  • Cornell University

External person

Guy Cohen

  • Saifun Semiconductors Ltd.

External person

G. Golan

  • Holon Institute of Technology
  • 68102
  • Ort Hermelin Technological College
  • Ariel University
  • Tel Aviv University
  • National Institute for Nuclear Physics
  • Open University of Israel

External person

A. Rozenblat-Raz

  • Micron Semiconductors Israel Ltd.
  • Tel Aviv University

External person

Y. Zinman

  • Sizary Limited
  • Tel Aviv University

External person

Kuo Juei Hu

  • KU Leuven

External person

Tommaso Santaniello

  • University of Milan

External person

Orly Yadid-Pecht

  • Technion-Israel Institute of Technology
  • Ben-Gurion University of the Negev
  • University of Calgary

External person

Amit Mishra

  • Thapar Institute of Engineering & Technology

External person

Paolo Milani

  • University of Milan

External person

Hamootal Duadi

  • Bar-Ilan University

External person

V. Altschul

  • Technion-Israel Institute of Technology

External person

Sebastian Peradotto

  • Polytechnic University of Turin

External person

Shimon Levi

  • Applied Materials Incorporated

External person

Sergey Kolen

  • Tel Aviv University

External person

Noriyuki Yamachika

  • Waseda University

External person

Aditya Ghodgaonkar

  • Thapar Institute of Engineering & Technology

External person

Mark Teo

  • University of British Columbia

External person

Els Vanderleyden

  • Ghent University

External person

Parteek Bhatia

  • Thapar Institute of Engineering & Technology

External person

Bhavya Surana

  • Thapar Institute of Engineering & Technology

External person

Carmit Porat

  • Tel Aviv University

External person

H. Moscovich

  • Tel Aviv University

External person

Yahav Avigal

  • Tel Aviv University

External person

Tao Hang

  • Shanghai Jiao Tong University

External person

J. Shappir

  • Hebrew University of Jerusalem

External person

W. N. Gill

  • Rensselaer Polytechnic Institute

External person

Polina Frumin

  • Tel Aviv University

External person

Alexander Mottel

  • Tel Aviv University

External person

Wolfram Jaegermann

  • Technische Universität Darmstadt

External person

Hahi Barhom

  • Tel Aviv University

External person

S. Yorish

  • Tel Aviv University

External person

Aaron Zhu

  • University of British Columbia

External person

Ido Ashuah

  • TOWER Semiconductor Ltd.
  • Intel
  • Tel Aviv University

External person

Balakrishna Kommanaboina

  • Thapar Institute of Engineering & Technology

External person

M. Iskandar

  • University of California at Irvine

External person

Sivan Natan

  • Elbit Systems Electro-Optics Elop Limited
  • Tel Aviv University

External person

Donata Marletta

  • University of Catania

External person

Yuval Lidor

  • Tel Aviv University

External person

M. Zajac

  • Tel Aviv University

External person

Ralf Hunger

  • Technische Universität Darmstadt
  • Helmholtz Centre Berlin for Materials and Energy

External person

R. Brener

  • Technion-Israel Institute of Technology
  • University of South Africa
  • Cadi Ayyad University
  • iThemba Labs
  • NOVA University Lisbon
  • Weizmann Institute of Science
  • University of Oregon

External person

Y. Hagiwara

  • Tokyo Ohka Kogyo Co., Ltd.

External person

D. P. Field

  • TexSEM Laboratories, Inc.

External person

A. Alberti

  • National Research Council of Italy

External person

L. C. Feldman

  • McKinsey and Company

External person

J. Scharinger

  • Johannes Kepler University Linz

External person

A. Minotti

  • National Research Council of Italy

External person

G. Bahir

  • Technion-Israel Institute of Technology

External person

Aviv Peled

  • CartaSense Ltd.

External person

Roey Shaviv

  • Tel Aviv University

External person

Hila Moscovich-Dagan

  • Tel Aviv University

External person

Sharon Yagurkroll

  • Hebrew University of Jerusalem

External person

C. Grant Willson

  • University of Texas at Austin
  • IBM

External person

Nan Jian

  • University of Birmingham

External person

J. Pellerin

  • Cornell University

External person

Sara Moon Villa

  • University of Milan

External person

Jonathan Ankri

  • Orbotech Ltd.

External person

A. Silmon

  • Newcastle University

External person

Valeri Morosow

  • University of Applied Science Bingen

External person

Tanmoy Paul

  • Technion-Israel Institute of Technology

External person

G. Belitsky

  • Tel Aviv University

External person

Chester Lee

  • Cornell University

External person

Yasser Khan

  • University of California at Berkeley

External person

Daniel Lubzens

  • Technion-Israel Institute of Technology

External person

Efraim Aharoni

  • TOWER Semiconductor Ltd.

External person

Katya Lishnevsky

  • Tel Aviv University

External person

Viktor Chetvertnykh

  • Perm State Medical University

External person

Yarden Zeron

  • Tel Aviv University

External person

William N. Partlo

  • University of California at Berkeley

External person

Phanourios Tamamis

  • Texas A&M University
  • University of Cyprus
  • Texas A and M University

External person

Rachel Rozen

  • Hebrew University of Jerusalem

External person

M. A. Nicolet

  • California Institute of Technology
  • California Institute of Technology Division of Engineering and Applied Science

External person

John Silcox

  • Cornell University

External person

Huiqin Ling

  • Shanghai Jiao Tong University

External person

Alex Vilkin

  • Tel Aviv University
  • Rabin Medical Center Israel
  • Sanz Medical Center-Laniado Hospital Israel
  • the Israeli Gastroenterology Association

External person

Assaf Avital

  • Tel Aviv University

External person

Natalie Shainsky

  • Tel Aviv University
  • Saifun Semiconductors Ltd.

External person

Michal Mossberg

  • Tel Aviv University

External person

Y. Kim

  • Advanced Micro Devices

External person

Maor Rotlain

  • Numonyx Israel Ltd.

External person

Hansuk Kim

  • Cornell University

External person

A. Minoti

  • National Research Council of Italy

External person

Ovadya Menadeva

  • Applied Materials Incorporated

External person

H. Y. Tong

  • Conexant

External person

Tan Chen Lee

  • Cornell University

External person

Klimentiy Levkov

  • Tel Aviv University

External person

Chengming Liu

  • University of California at Berkeley

External person

Ada Rephaeli

  • Tel Aviv University
  • Rabin Medical Center Israel
  • Ansan Inc.

External person

R. Kalish

  • Technion-Israel Institute of Technology
  • Weizmann Institute of Science

External person

Shigeki Kuroiwa

  • Waseda University

External person

Liwei Lin

  • University of California at Berkeley

External person

D. Shani

  • Afeka Academic College of Engineering

External person

Shlomo Magdassi

  • Hebrew University of Jerusalem

External person

A. Kornfeld

  • Technion-Israel Institute of Technology

External person

Vladimir Ya Shur

  • Ural Federal University
  • Ural Institute of Forestry

External person

Nathan Jackson

  • University College Cork

External person

Sho Hideshima

  • Waseda University

External person

Elena Bruno

  • University of Catania

External person

Victor Grimblatt

  • Synopsys Chile Limitada

External person

Asad Awadallah

  • Hebrew University of Jerusalem

External person

Rona Ortenberg

  • Tel Aviv University
  • Sheba Medical Center at Tel Hashomer
  • Cancer Research Center
  • Ella Lemelbaum Institute for Immuno-Oncology

External person

Noel C. MacDonald

  • Cornell University

External person

Federico Pezzotta

  • University of Milan

External person

Yishai Nachumovsky

  • National Semiconductors, Incorporated

External person

Junyi Zhou

  • Tel Aviv University

External person

D. Schrieber

  • Tel Aviv University

External person

S. K. Dew

  • University of Alberta

External person

Israel Rotshtein

  • TOWER Semiconductor Ltd.

External person

Michael Zenou

  • Orbotech Ltd.
  • Hebrew University of Jerusalem

External person

Y. Nemirovsky

  • Technion-Israel Institute of Technology
  • T.
  • IEEE
  • R and D Organization
  • URSI
  • Kidron Microelectronics Research

External person

B. K. Ridley

  • Cornell University

External person

Oleg Ermak

  • Orbotech Ltd.

External person

G. Franzò

  • University of Catania

External person

O. Degani

  • Technion-Israel Institute of Technology
  • Tel Aviv University
  • Intel
  • IEEE
  • Kidron Microelectronics Research
  • T.

External person

Itzhak Mazor

  • Tel Aviv University

External person

Yoed Tsur

  • Technion-Israel Institute of Technology

External person

G. Hirschberg

  • Tel Aviv University

External person

Y. Komem

  • Technion-Israel Institute of Technology
  • Columbia University

External person

Salvo Bordonaro

  • University of Catania

External person

Daisuke Niwa

  • Waseda University

External person

C. Lee

  • Cornell University

External person

Mariko Matsunaga

  • Waseda University

External person

Sheldon M. Kugelmass

  • Cornell University

External person

So Kudo

  • Waseda University

External person

F. Dupuis

  • University of California at Berkeley

External person

S. Winter

  • Orbotech Ltd.

External person

R. Pedhazur

  • Hebrew University of Jerusalem

External person

M. J. Brett

  • University of Alberta

External person

Bin Zhoo

  • SEMATECH
  • The Electrochemical Society

External person

Gil Geva

  • Tel Aviv University

External person

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