Material Science
Film
100%
Electroless Deposition
56%
Thin Films
54%
Surface (Surface Science)
47%
Silicon
42%
Tungsten
33%
Microelectromechanical System
32%
Biosensor
28%
Electrical Resistivity
28%
Oxide Compound
25%
Dielectric Material
25%
Cobalt
21%
Electronic Circuit
21%
Dielectric Spectroscopy
19%
Self Assembled Monolayer
16%
Capacitance
15%
Plating
14%
Materials Property
14%
Nitride Compound
14%
Transistor
13%
Silver
13%
Scanning Electron Microscopy
13%
Annealing
12%
Capacitor
12%
Gold Nanoparticles
12%
Monolayers
12%
Lithography
12%
Electrochemical Cell
11%
Actuator
11%
Silicon Dioxide
10%
Electrochemical Sensor
10%
Boron
10%
Charge Trapping
9%
Electrical Impedance
9%
Polypyrrole
9%
Three Dimensional Printing
8%
Sodium
8%
Nucleation
8%
Phosphatase
8%
Nanoparticle
8%
Hydrogel
7%
ZnO
7%
Titanium
7%
Reducing Agent
7%
Cyclic Voltammetry
7%
Electrodeposition
7%
Density
6%
Cobalt Alloy
6%
Hot Carrier
6%
Chemical Vapor Deposition
6%
Keyphrases
Electroless
70%
Electroless Deposition
47%
Biochip
31%
Tungsten
29%
Metallization
27%
Whole Cell
26%
Electrical Properties
25%
Silica
22%
Self-assembled Monolayer
21%
Annealing
21%
Ultralarge-scale Integration
18%
Resistivity
18%
Electroless Plating
18%
Barrier Layer
18%
Copper Metallization
18%
Electroless Copper Deposition
17%
W Film
17%
Whole-cell Biosensor
17%
Oxides
15%
Electrochemical Biosensor
15%
Material Properties
14%
CoWP
14%
Capping Layer
14%
Electrochemical Sensor
14%
Electrolyte
14%
Diffusion Barrier
13%
Localized Charges
13%
Reducing Agent
13%
Water Toxicity
13%
Deposition Rate
12%
Spinon
12%
Microelectronics
11%
Ion Implantation
11%
Au Nanoparticles (AuNPs)
11%
Non-volatile Memory
11%
Charge Trapping
11%
Electrical Conductivity
10%
Electrochemical Studies
10%
On-glass
10%
Cobalt
10%
Micro-electro-mechanical Systems
10%
Transistor
10%
Aspect Ratio
10%
Gold Nanoparticles
10%
Boron
10%
Order of Magnitude
9%
Room Temperature
9%
Alkaline Phosphatase
9%
Capacitors
9%
Seed Layer
8%
Engineering
Metallizations
57%
Electroless Plating
55%
Thin Films
55%
Interconnects
36%
Silicon Dioxide
31%
Barrier Layer
25%
Dielectrics
25%
Microelectronics
20%
Diffusion Barrier
19%
Bioinstrumentation
18%
Biosensor
17%
Self-Assembled Monolayers
16%
Deposition Rate
15%
Aspect Ratio
14%
Capping Layer
13%
Microelectromechanical System
12%
ULSI Circuits
12%
Biosensing
12%
High Aspect Ratio
11%
Deposited Film
11%
Electrochemical Sensor
11%
Actuator
11%
Electrochemical Biosensors
11%
Seed Layer
10%
Experimental Result
10%
Conductive
10%
Nonvolatile Memory
9%
Low-Temperature
9%
Deposition Process
9%
Nitride
9%
Two Dimensional
9%
Electrical Impedance
9%
Diffusivity
8%
Nanoscale
8%
Integrated Circuit
8%
Current Signal
8%
Electric Field
7%
Gold Nanoparticles
7%
Nanometre
7%
Porosity
7%
Microsystem
7%
Cu Film
6%
Aqueous Solution
6%
Enzymatic Activity
6%
Barrier Property
6%
Si Substrate
6%
Metal-Oxide-Semiconductor Field-Effect Transistor
6%
Surface Coverage
6%
Scale Integration
6%
Chemical Vapor Deposition
6%
