Material Science
Film
100%
Electroless Deposition
54%
Thin Films
54%
Silicon
42%
Tungsten
33%
Microelectromechanical System
29%
Electrical Resistivity
27%
Silver
27%
Dielectric Material
25%
Oxide Compound
24%
Oxidation Reaction
24%
Cobalt
22%
Electronic Circuit
21%
Dielectric Spectroscopy
20%
Self Assembled Monolayer
16%
Capacitance
15%
Plating
14%
Nitride Compound
14%
Transistor
13%
Annealing
13%
Capacitor
12%
Scanning Electron Microscopy
12%
Gold Nanoparticle
12%
Lithography
12%
Monolayers
12%
Materials Property
11%
Electrochemical Cell
11%
Actuator
11%
Silicon Dioxide
10%
Boron
10%
Three Dimensional Printing
10%
Charge Trapping
10%
Sodium
9%
Polypyrrole
8%
Phosphatase
8%
Nanoparticle
8%
Nucleation
8%
Electrical Impedance
7%
Titanium
7%
Reducing Agent
7%
Hot Carrier
6%
Chemical Vapor Deposition
6%
Amorphous Silicon
6%
Cyclic Voltammetry
6%
Electrodeposition
6%
Secondary Ion Mass Spectrometry
6%
Amorphous Material
6%
Thermal Stability
6%
Density
6%
Hydrogel
6%
Keyphrases
Electroless
71%
Electroless Deposition
48%
Biochip
32%
Tungsten
29%
Metallization
27%
Electrical Properties
26%
Whole Cell
25%
Silica
23%
Self-assembled Monolayer
21%
Annealing
21%
Ultralarge-scale Integration
19%
Resistivity
19%
Barrier Layer
18%
Copper Metallization
18%
Electroless Copper Deposition
17%
W Film
17%
Whole-cell Biosensor
17%
Electroless Plating
17%
Oxides
15%
Electrochemical Biosensor
15%
Material Properties
15%
CoWP
14%
Capping Layer
14%
Electrolyte
14%
Diffusion Barrier
13%
Localized Charges
13%
Reducing Agent
13%
Water Toxicity
13%
Deposition Rate
12%
Spinon
12%
Microelectronics
12%
Electrochemical Sensor
11%
Ion Implantation
11%
Au Nanoparticles (AuNPs)
11%
Non-volatile Memory
11%
Charge Trapping
11%
Electrical Conductivity
10%
Electrochemical Studies
10%
On-glass
10%
Cobalt
10%
Micro-electro-mechanical Systems
10%
Transistor
10%
Aspect Ratio
10%
Boron
10%
Order of Magnitude
10%
Room Temperature
9%
Alkaline Phosphatase
9%
Capacitors
9%
Seed Layer
9%
Toxicity Detection
9%
Engineering
Metallizations
57%
Thin Films
55%
Interconnects
37%
Biosensor
31%
Barrier Layer
27%
Dielectrics
25%
Microelectronics
20%
Diffusion Barrier
20%
Self-Assembled Monolayers
16%
Deposition Rate
16%
Microstructure
15%
Capping Layer
15%
Aspect Ratio
15%
Electroless Plating
14%
ULSI Circuits
12%
Microelectromechanical System
12%
Deposited Film
12%
High Aspect Ratio
11%
Seed Layer
11%
Biosensing
11%
Electrochemical Biosensors
11%
Diffusivity
11%
Experimental Result
10%
Conductive
10%
Nonvolatile Memory
10%
Electrochemical Sensor
10%
Deposition Process
9%
Low-Temperature
9%
Nitride
9%
Two Dimensional
9%
Nanoscale
8%
Electrical Impedance
8%
Integrated Circuit
8%
Transmissions
8%
Si Substrate
8%
Electric Field
8%
Current Signal
8%
Gold Nanoparticle
7%
Nanometre
7%
Microsystem
7%
Nanoparticle
7%
Cu Film
6%
Enzymatic Activity
6%
Metal-Oxide-Semiconductor Field-Effect Transistor
6%
Chemical Vapor Deposition
6%
Scale Integration
6%
Grain Boundary
6%
Adsorption
6%
Barrier Property
6%
High Resolution
5%
