Equipments Details
Description
Manufacturer and model:
Kulicke & Soffa 4524 Wedge Wire Bonder.
Description:
K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the Power Ribbon process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section.
Specification:
± 0.5 µm placement accuracy.
± 1 µm post-bond accuracy.
Location:
Wolfson building of Electrical Engineering, Room #301
Kulicke & Soffa 4524 Wedge Wire Bonder.
Description:
K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the Power Ribbon process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section.
Specification:
± 0.5 µm placement accuracy.
± 1 µm post-bond accuracy.
Location:
Wolfson building of Electrical Engineering, Room #301

×
Fingerprint
Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.