Equipments Details
Description
VST TFDS-680
Description:
Capable of heating materials to high temperature, high purity film, very high deposition rates and evaporation of high temperature materials and refractory metals. Can evaporate high melting point materials.
Materials:
Au, Ag, Al, Co, Cr, Cu, In, Nb, Ni, Mo, Pd, Pt, Sn, Ta, Ti, W.
Specification:
Up to 4‘’ wafers.
Load lock.
Rotating sample holder.
Base pressure 5x10-7 Torr.
Typical deposition rate: 0.5 Å/sec.
Full wafer deposition
Location:
Clean Room, Nano center building.
Description:
Capable of heating materials to high temperature, high purity film, very high deposition rates and evaporation of high temperature materials and refractory metals. Can evaporate high melting point materials.
Materials:
Au, Ag, Al, Co, Cr, Cu, In, Nb, Ni, Mo, Pd, Pt, Sn, Ta, Ti, W.
Specification:
Up to 4‘’ wafers.
Load lock.
Rotating sample holder.
Base pressure 5x10-7 Torr.
Typical deposition rate: 0.5 Å/sec.
Full wafer deposition
Location:
Clean Room, Nano center building.

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