Equipments Details
Description
Physical Vapor Deposition VST TFDS-870
Capable of heating materials to high temperature, high purity film, very high deposition rates, and evaporation of high-temperature materials and refractory metals. Can evaporate high melting point materials.
Materials: Au, Ag, Co, Cr, Cu, In, Nb, Ni, Mo, Pd, Pt, Sn, Ta, Ti, W, Fe, CF2, MgF.
Specification:
Up to 4‘’ wafers.
Rotating sample holder.
Typical deposition rate: 0.5 Å/sec.
Nitrogen environment to avoid oxidation.
Full wafer deposition
Location:
Glove box lab, Nano center building.
Capable of heating materials to high temperature, high purity film, very high deposition rates, and evaporation of high-temperature materials and refractory metals. Can evaporate high melting point materials.
Materials: Au, Ag, Co, Cr, Cu, In, Nb, Ni, Mo, Pd, Pt, Sn, Ta, Ti, W, Fe, CF2, MgF.
Specification:
Up to 4‘’ wafers.
Rotating sample holder.
Typical deposition rate: 0.5 Å/sec.
Nitrogen environment to avoid oxidation.
Full wafer deposition
Location:
Glove box lab, Nano center building.

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