Rapid Thermal Processing RTP

  • Nirit Porecki-Shamay (Manager)

Equipment/facility: Equipment

    Equipments Details

    Description

    Manufacturer and model:
    JIPELEC JETFIRST 100C.

    Description:
    Rapid Thermal Processing is a rapid heating process of a single wafer using lamp base heating for a short time, in order to affect its electrical properties.

    Specification:
    Base pressure is 10-6 Torr.
    Gases: N2, O2, Ar and Forming Gas.
    Max temperature is 1100oC.
    Minimum pulse width: 1s.

    ​Location:
    Engineering Cleanroom, Wolfson Building of Electrical Engineering​.

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