Equipments Details
Description
Manufacturer and model:
The KLA-Tencor P-6 Stylus Profiles.
Description:
Stylus profilometer for measurements of surface roughness, film thickness and wafer stress analysis.
Common applications:
Photoresist thickness, deposited material thickness, etch depth, surface roughness, etc.
Specification:
2D surface topography measurements.
Step height: Nanometers to 1000µm.
Low force with constant force control: 0.5 to 50mg.
The scan full diameter of the sample without stitching.
Radius tip of 2 microns.
Motorized stage up to 150mm.
Vacuum holder.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
The KLA-Tencor P-6 Stylus Profiles.
Description:
Stylus profilometer for measurements of surface roughness, film thickness and wafer stress analysis.
Common applications:
Photoresist thickness, deposited material thickness, etch depth, surface roughness, etc.
Specification:
2D surface topography measurements.
Step height: Nanometers to 1000µm.
Low force with constant force control: 0.5 to 50mg.
The scan full diameter of the sample without stitching.
Radius tip of 2 microns.
Motorized stage up to 150mm.
Vacuum holder.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
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