Equipments Details
Description
Manufacturer and model:
Plasmatic Systems, Inc. Plasma Preen II #973.
Description:
Device and wafer surface cleaning treatments procedures, removal of organic residuals and native oxides.
Specification:
Water cooled reactor with 9’’ x 7’’ x 3’’ Reaction Chamber.
Material: Pyrex & Aluminum.
Gas Supply: Argon and Oxygen.
60Hz power.
Electrical Specifications: 120V, 60Hz.
Maximum Temperature: 200°C.
Temperature Range: 25° to 200°C.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
Plasmatic Systems, Inc. Plasma Preen II #973.
Description:
Device and wafer surface cleaning treatments procedures, removal of organic residuals and native oxides.
Specification:
Water cooled reactor with 9’’ x 7’’ x 3’’ Reaction Chamber.
Material: Pyrex & Aluminum.
Gas Supply: Argon and Oxygen.
60Hz power.
Electrical Specifications: 120V, 60Hz.
Maximum Temperature: 200°C.
Temperature Range: 25° to 200°C.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
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