Mask Aligner MA6/BA GEN4

  • Erez Benjamin (Other)University Center for Nanoscience and Nanotechnology, Tel Aviv University

Equipment/facility: Equipment

    Equipments Details

    Description

    Manufacturer and model:
    KARL SUSS MA/BA6 Mask Aligner.
    Description:
    The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production. It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality. The bottom side alignment option allows for pattern printing on both sides of the substrate.
    Specification:
    Flood exposure, soft, hard, and vacuum contact capable.
    Topside and backside alignment.
    1 ┬Ám feature size. Resolution in thin resists.
    Chucks and mask holders in different sizes.
    Processing of wafers or squares from 2" to 150mm.
    Location:
    Engineering Cleanroom, Wolfson building of Electrical Engineering.

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