Equipments Details
Description
Manufacturer and model:
KARL SUSS MA/BA6 Mask Aligner.
Description:
The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production. It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality. The bottom side alignment option allows for pattern printing on both sides of the substrate.
Specification:
Flood exposure, soft, hard, and vacuum contact capable.
Topside and backside alignment.
1 µm feature size. Resolution in thin resists.
Chucks and mask holders in different sizes.
Processing of wafers or squares from 2" to 150mm.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
KARL SUSS MA/BA6 Mask Aligner.
Description:
The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production. It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality. The bottom side alignment option allows for pattern printing on both sides of the substrate.
Specification:
Flood exposure, soft, hard, and vacuum contact capable.
Topside and backside alignment.
1 µm feature size. Resolution in thin resists.
Chucks and mask holders in different sizes.
Processing of wafers or squares from 2" to 150mm.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
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