Equipments Details
Description
Vinci Technologies PVD20
Description:
Nearly all materials can be deposited by magnetron sputtering regardless of their melting temperature.
Materials:
Au, Ag, Al, Cr, Cu, In, Ni, Mo, Si-intr, Ta, Ti, Al2O3, BN, ITO, Ni:Cr(80:20), SiC, SiO2, SiNx, TiN, TiO2.
Specification:
Up to 6‘’ wafers.
Load lock with Ar plasma preclean.
5 heads (1RF/4DC).
Heating up to 350˚C.
Description:
Nearly all materials can be deposited by magnetron sputtering regardless of their melting temperature.
Materials:
Au, Ag, Al, Cr, Cu, In, Ni, Mo, Si-intr, Ta, Ti, Al2O3, BN, ITO, Ni:Cr(80:20), SiC, SiO2, SiNx, TiN, TiO2.
Specification:
Up to 6‘’ wafers.
Load lock with Ar plasma preclean.
5 heads (1RF/4DC).
Heating up to 350˚C.
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