Equipments Details
Description
Description:
Precise laser micro machining is achieved by ultra-short laser pulses, precision of positioning stages and state of the art optics. In MASTER series workstations femtosecond laser pulses cause minimal heat-affected zone and maximize spatial precision. Femto-second pulse laser direct sublimation of all materials.
Specification:
Three possible wavelengths: 1064nm, 532nm and 355nm (UV, VIS, NIR).
Pulse length 280 femtosecond.
Power up to 10W.
Pulse rate between 44KHz and 200KHz.
Stage Precision ±1 micron.
Spot size 2μm at 355nm, 30μm micron at 1064nm.
Travel XY: 200mm Z: 100mm.
Control by SCA software, can use DXF, PLT and STL files.
Machining Applications:
Glass, thin metal sheets, Si wafer cutting, Polyimide (Kapton), PDMS, biopolymers, ceramics, silicon nitride membranes, sapphire, diamond, carbon-fiber enforced resin.
Location:
Nano center building
Precise laser micro machining is achieved by ultra-short laser pulses, precision of positioning stages and state of the art optics. In MASTER series workstations femtosecond laser pulses cause minimal heat-affected zone and maximize spatial precision. Femto-second pulse laser direct sublimation of all materials.
Specification:
Three possible wavelengths: 1064nm, 532nm and 355nm (UV, VIS, NIR).
Pulse length 280 femtosecond.
Power up to 10W.
Pulse rate between 44KHz and 200KHz.
Stage Precision ±1 micron.
Spot size 2μm at 355nm, 30μm micron at 1064nm.
Travel XY: 200mm Z: 100mm.
Control by SCA software, can use DXF, PLT and STL files.
Machining Applications:
Glass, thin metal sheets, Si wafer cutting, Polyimide (Kapton), PDMS, biopolymers, ceramics, silicon nitride membranes, sapphire, diamond, carbon-fiber enforced resin.
Location:
Nano center building
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