Equipments Details
Description
Electroplating using Yamamoto YPP-15100 Programmable Power Supply
Description:
Electroplating set for 4 inch silicon wafers or custom made dimensions, intended for Nickel coating from Nickel sulfate solutions and Copper coating from Copper sulfate solutions.
Materials:
Cu, Ni.
Specification:
Up to 4‘’ wafers.
Deposition rate is controlled by the current.
Fast deposition rate compared to other deposition processes, possible to deposit thick layers
Location:
Room #301, Wolfson building of Electrical Engineering.
Description:
Electroplating set for 4 inch silicon wafers or custom made dimensions, intended for Nickel coating from Nickel sulfate solutions and Copper coating from Copper sulfate solutions.
Materials:
Cu, Ni.
Specification:
Up to 4‘’ wafers.
Deposition rate is controlled by the current.
Fast deposition rate compared to other deposition processes, possible to deposit thick layers
Location:
Room #301, Wolfson building of Electrical Engineering.
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