Electroplating Yamamoto

  • Boris Yofis (Manager)

Equipment/facility: Equipment

    Equipments Details


    Electroplating using Yamamoto YPP-15100 Programmable Power Supply

    Electroplating set for 4 inch silicon wafers or custom made dimensions, intended for Nickel coating from Nickel sulfate solutions and Copper coating from Copper sulfate solutions.

    Cu, Ni.

    Up to 4‘’ wafers.
    Deposition rate is controlled by the current.
    Fast deposition rate compared to other deposition processes, possible to deposit thick layers

    Room #301, Wolfson building of Electrical Engineering.


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