Diode Sputtering MRC 8620

  • Gidon Jacob (Manager)

Equipment/facility: Equipment

    Equipments Details


    Manufacturer and model:
    RF Diode Sputtering System MRC 8620-VST.

    Au, Ag, Co, Cr, Cu, Ni, Ta, Ti, W, CF2, ITO, SO, SiO2, SiNx, TaN, TiN, TiO2.

    Up to 6‘’ wafers.
    No load lock.
    Base pressure 8x10-7Torr.
    Working pressure 5x10-3 – 50x10-3 Torr.
    3 targets.
    Reactive sputtering with N2 and O2.
    Substrate biasing possibility, also during sputtering process.

    Room #301, Wolfson building of Electrical Engineering.
    Photo associated with equipment - mrc_sputter.png


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